Applications Engineering, Staff Engineer

Bygg, teknik och hantverk · Bygg- och industriteknik · Maskinteknik

I korthet

Synopsys seeks a Staff Applications Engineer in Taipei, Taiwan, to provide technical leadership and customer engagement for simulation-driven design and AI-powered engineering workflows. This role focuses on semiconductor, advanced packaging, AI infrastructure, and electronics system customers, requiring strong technical expertise, problem-solving skills, and experience in relevant engineering disciplines.

Ansvarsområden

Provide technical leadership and application support for simulation-driven design and engineering workflows.
Work directly with customer engineering teams to understand design challenges and develop effective technical solutions.
Deliver software evaluations, proof-of-concepts (PoCs), benchmarks, and customer demonstrations.
Support strategic accounts and help customers maximize the value of Synopsys solutions.
Drive customer adoption and deployment of advanced simulation methodologies.
Support semiconductor and advanced packaging customers in solving complex thermo-mechanical and reliability challenges.
Develop application methodologies for Advanced Packaging, CoWoS, Chiplet Architectures, Hybrid Bonding, Fan-Out Packaging, Heterogeneous Integration, and AI/HPC Package Development.
Conduct engineering studies related to Warpage Prediction, Thermo-Mechanical Reliability, Stress Analysis, Fatigue and Life Prediction, Material Characterization, and Process-Induced Deformation.
Collaborate with customers to establish AI-powered engineering workflows and automation frameworks.
Drive adoption of AI-assisted simulation and design optimization technologies.
Support implementation of Engineering Automation, AI Agents for Engineering Applications, Design Exploration, Surrogate Modeling, Machine Learning-based Optimization, and Digital Engineering Platforms.
Develop workflow automation solutions using scripting and programming tools such as Python.
Apply simulation technologies across Structural Analysis, Thermal Management, Computational Fluid Dynamics (CFD), Vibration and Dynamic Analysis, Electronics Cooling, and System-Level Engineering.
Assist customers in developing digital twin and model-based engineering methodologies.
Work closely with R&D, Product Management, Sales, and Global Applications Engineering teams.
Provide technical feedback and market requirements to product development organizations.
Participate in customer visits, executive meetings, technical workshops, and industry conferences.
Contribute to technical publications, best practices, and knowledge-sharing activities.

Krav

M.S. or Ph.D. degree in Mechanical Engineering, Materials Science, Aerospace Engineering, Electrical Engineering, Computer Engineering, Applied Physics, or Related Engineering Disciplines.
5+ years of industry experience in semiconductor, advanced packaging, electronics systems, simulation software, or related engineering fields.
Hands-on experience supporting engineering teams in semiconductor manufacturing, OSAT, IC design, HPC, AI server, electronics, or system development environments.
Experience in one or more of the following areas: Finite Element Analysis (FEA), Structural Mechanics, Reliability Engineering, Fatigue Analysis, Vibration & Dynamics, Multi-Physics Simulation.
Experience in one or more of the following areas: Advanced Packaging Technologies, Chiplet Integration, Heterogeneous Integration, Thermal/Mechanical Reliability, Wafer-Level Packaging, Package Warpage, Manufacturing Process Simulation.
Experience in one or more of the following areas: Engineering Workflow Automation, AI/ML Applications for Engineering, Surrogate Modeling, Design Space Exploration, Data Analytics, Python Programming, AI Agents / LLM-enabled Engineering Workflows.
Experience with Linux Environment, HPC Clusters, Parallel Computing, Cloud-based Engineering Platforms.

Önskade kvalifikationer

Experience interacting with customers in technical consulting, application engineering, or solution deployment roles is highly preferred.
Experience with Synopsys, Ansys, Abaqus, Siemens, Cadence, or equivalent engineering simulation platforms.
Knowledge of AI infrastructure, GPU systems, server design, or data center technologies.
Experience in model-based systems engineering (MBSE), digital twins, or digital engineering initiatives.
Familiarity with semiconductor ecosystem leaders, foundries, OSATs, and electronics manufacturing workflows.
Strong presentation skills with the ability to communicate complex technical concepts to both engineering and executive audiences.
Self-driven, customer-focused, and capable of leading highly visible technical engagements.

Förmåner

Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.

Färdigheter

SimulationFinite Element AnalysisFEAStructural MechanicsReliability EngineeringFatigue AnalysisVibration & DynamicsMulti-Physics SimulationAdvanced PackagingChiplet IntegrationHeterogeneous IntegrationThermal/Mechanical ReliabilityWafer-Level PackagingPackage WarpageManufacturing Process SimulationEngineering Workflow AutomationAI/ML Applications for EngineeringSurrogate ModelingDesign Space ExplorationData AnalyticsPythonAI AgentsLLMLinuxHPCParallel ComputingCloudAnsysAbaqusSiemensCadenceAI infrastructureGPUServer designData centerMBSEDigital twinsDigital engineering

#Engineering#Applications Engineering#Staff Engineer#Simulation#Semiconductor#Advanced Packaging#AI#Electronics

Om Synopsys Inc

Smart, Secure Everything—From Silicon to Software Synopsys technology is at the heart of innovations that are changing the way we live and work. The Internet of Things. Autonomous cars. Wearables. Smart medical devices. Secure financial services. Machine learning and computer vision. These breakthroughs are ushering in the era of Smart, Secure Everything―where devices are getting smarter, everything’s connected, and everything must be secure. Powering this new era of technology are advanced silicon chips, which are made even smarter by the remarkable software that drives them. Synopsys is at…

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