Solution Director

Manufacturing & Production · Production & Assembly · Manufacturing Engineering

In short

The OSAT Interface Manager is the primary technical and program interface between HCLTech and OSAT partners for semiconductor package development, assembly, and testing. This role manages the end-to-end OSAT engagement to ensure product requirements, quality, schedule, and cost objectives are met.

Responsibilities

Act as the primary technical interface with OSAT partners, defining and communicating requirements.
Coordinate package design, assembly, and test activities, including die attach, wire bonding, molding, and final test.
Manage OSAT NPI activities from package definition through production release, tracking milestones and deliverables.
Monitor assembly and test yield, driving root-cause analysis and corrective actions for issues.
Coordinate package qualification and reliability activities with OSAT, including HTOL, HAST, and mechanical reliability.
Manage project schedules, costs (NRE, tooling, assembly, test), and capacity planning.
Escalate critical technical, quality, cost, and schedule issues.

Requirements

10+ years of experience in semiconductor packaging, assembly, product engineering, test, or OSAT operations.
Strong experience working directly with OSAT organizations.
Experience with package technologies such as QFN, QFP, BGA, or similar.
Strong understanding of die attach, wire bonding, molding, leadframe/substrate, singulation, package inspection, final test, and reliability qualification.
Experience managing semiconductor NPI programs.
Experience in yield improvement and semiconductor failure analysis.
Strong cross-functional communication and program-management skills.

Desired Qualifications

Automotive semiconductor/AEC-Q100 experience is desirable.
Experience with automotive semiconductor products.
Experience working with OSATs such as ASE, Amkor, JCET, UTAC, SPIL, or equivalent.
Experience with QFN/QFP packages and wire-bond assembly.
Experience taking semiconductor products from engineering build through qualification and production ramp.
Ability to work across engineering, quality, procurement, operations, and customer teams.

Benefits

Supercharge your potential at HCLTech.
Find your career and spark at a company that puts people first.
Global technology company with over 223,000 people across 60 countries.
Consolidated revenues of $14.8 billion for the 12 months ending June 2026.

Skills

Semiconductor PackagingAssemblyProduct EngineeringTestOSAT OperationsQFNQFPBGADie AttachWire BondingMoldingLeadframeSubstrateSingulationPackage InspectionFinal TestReliability QualificationNPIYield ImprovementFailure AnalysisAEC-Q100Program Management

#Semiconductor#Package Development#Assembly#Testing#NPI#Yield Improvement#Reliability#OSAT#QFN#QFP#BGA#Automotive#AEC-Q100

About HCLTech

Supercharging progress through technology and innovation

HCLTech is a global technology company, home to 219,000+ people across 54 countries, delivering industry-leading capabilities centered around digital, engineering and cloud, powered by a broad portfolio of technology services and products. We work with clients across all major verticals, providing industry solutions for Financial Services, Manufacturing, Life Sciences and Healthcare, Technology and Services, Telecom and Media, Retail and CPG, and Public Services. Consolidated revenues as of 12 months ending September 2022 totaled $12.1 billion. To learn how we can supercharge progress for…

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