Staff IC Packaging Engineer - Mechanical Simulation
Technology, Data & Digital · Software & Web Development · Software Engineering
In short
Qualcomm is seeking a Staff IC Packaging Engineer with FEA expertise to provide mechanical simulation support for advanced packaging technologies. Responsibilities include developing FEA models, performing stress analysis, and predicting failures. Requires strong communication and project execution skills.
Responsibilities
- Provide mechanical simulation support for current HVM and advanced packaging technologies.
- Develop mechanical FEA models using ANSYS APDL and Workbench.
- Maintain APDL macros/workflows.
- Establish FEA methodologies/BKM for test correlation, material characterization.
- Perform stress/mechanical analysis for IC package designs and failure prediction.
- Conduct Warpage/Stress analysis, Solder joint reliability (SJR) prediction, package assembly process simulation, and chip package interaction (CPI) analysis.
- Utilize advanced Finite Element Analysis (FEA) techniques (sub-modeling approach, contact analysis, non-linear analysis).
- Use test procedures for material characterization/testing.
Requirements
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
- OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
- OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.
- 6+ years of combined experience in Finite Element modeling and Analysis for IC electronic package and interconnects.
- 3+ years of experience in ANSYS (APDL/Workbench).
- 4+ years of direct work experience in Semiconductor and IC microelectronic packaging industry.
- Solid understanding of IC packaging materials and their thermo-mechanical behaviors.
- Strong analytical skills.
- Excellent communication and presentation skills.
- High motivation and a strong commitment to product success.
Desired Qualifications
- Ph. D degree in Mechanical engineering, Material science, Electrical/Microelectronics, or related engineering field.
- Experience with the fundamentals of IC electronic packaging structures, assembly processes, reliability testing and analysis, CPI, Package-Board interaction, and design of experiments (DOE).
- Hands-on FEA experience developing and improving BKMs for predictive modeling to guide package mechanical design and support manufacturing and reliability needs.
- Experience with material characterization/testing and developing new test methods to improve package FEA model accuracy and prediction correlation.
- Research and publications in FEA predictive modeling, Warpage, CPI, and Solder lifetime prediction (plus).
- Experience using internal AI tools to accelerate APDL coding and improve simulation workflows (plus).
- Able to work flexible hours to support collaboration across APAC and the U.S.
- Occasional domestic and international travel may be required.
Benefits
- Competitive annual discretionary bonus program.
- Opportunity for annual RSU grants.
- Highly competitive benefits package designed to support your success at work, at home, and at play.
Skills
ANSYSFEAMechanical SimulationSolder joint reliabilityCPIPackaging Engineering
#Packaging Engineering#Mechanical Simulation#FEA#ANSYS#IC Packaging
About Qualcomm
Enabling a world where everyone and everything can be intelligently connected.
Enabling a world where everyone and everything can be intelligently connected.\n\n
Company
QualcommJob Posted
1 day ago
Employment Type
Full Time
Work mode
On Site
Salary
US$160,200–240,200 / year
Experience Level
Senior
Locations
San Diego, United States of America
Qualification
Master, Doctoral, Bachelor
Applicants
Be an early applicant
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