Solution Architect

Technology, Data & Digital · Software & Web Development · Software Engineering

In short

Der Chip Lead bei HCLTech treibt End-to-End-SoC/ASIC-Programme für globale Kunden voran und ist für die Lieferung, Kundenbindung und technische Führung verantwortlich. Die Rolle kombiniert tiefgreifende VLSI-Expertise mit starken Programmmanagement- und kundenorientierten Aufgaben.

Responsibilities

Own end-to-end chip program delivery for customer engagements (architecture to silicon bring-up)
Act as primary technical interface to customers, driving trust, reviews, and escalations
Lead cross-functional teams across: RTL Design, Verification (UVM-based), Physical Design (PnR, STA, Signoff), DFT and integration
Drive program planning, estimation, and execution in a services environment
Ensure adherence to schedule, quality, and PPA (Power, Performance, Area) targets
Manage risk, dependencies, and change requests in dynamic customer programs
Support pre-sales and solutioning: Effort estimation, Proposal reviews, Technical win support
Enable scaling of teams (onsite-offshore model) and optimize utilization
Lead tapeout readiness reviews and post-silicon debug coordination
Drive account growth (identify new opportunities within existing customers)
Balance delivery excellence + margin awareness
Mentor next-level leaders (Module Leads, Project Leads)
Bring execution rigor with customer-centric mindset
Strong communication for CXO-level interactions

Requirements

15–20+ years in VLSI / SoC development
Proven experience leading customer-facing chip programs
Strong knowledge of SoC architecture and integration
Strong knowledge of RTL to GDSII full flow
Strong knowledge of Verification methodologies (UVM)
Strong knowledge of Physical design and signoff
Experience in multiple successful tapeouts
Strong stakeholder management (customer + internal)
Ability to lead distributed/global teams (onsite–offshore)

Desired Qualifications

Experience working in semiconductor services companies (e.g., large SI/ES firms)
Exposure to advanced nodes (≤7nm)
Experience with IPs (CPU subsystems, high-speed interfaces, AI/ML accelerators)
Familiarity with foundry interactions and tapeout processes

Benefits

On-time, first-time-right tapeouts
Customer satisfaction and repeat business
Program margin and efficiency
Team retention and capability growth

Skills

SoC architectureRTLUVMPhysical DesignSTASignoffVLSIASICIPAI/ML

#VLSI#SoC#ASIC#Chip Design#RTL Design#Verification#Physical Design#DFT#Integration#Tapeout#Semiconductor#IP Integration#AI/ML Accelerators#Leadership#Program Management

About HCLTech

Supercharging progress through technology and innovation

HCLTech is a global technology company, home to 219,000+ people across 54 countries, delivering industry-leading capabilities centered around digital, engineering and cloud, powered by a broad portfolio of technology services and products. We work with clients across all major verticals, providing industry solutions for Financial Services, Manufacturing, Life Sciences and Healthcare, Technology and Services, Telecom and Media, Retail and CPG, and Public Services. Consolidated revenues as of 12 months ending September 2022 totaled $12.1 billion. To learn how we can supercharge progress for…

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