Package Design Engineer - Staff

Technology, Data & Digital · Software & Web Development · Software Engineering

In short

Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work! The role involves owning and driving advanced package selection, new generation product package structure, and configuration optimization. You will be responsible for Package/SIP physical design and layout, optimization, DV, and tape out, working with multi-functional teams to achieve optimized mechanical, electrical, and thermal performance.

Responsibilities

Own and drive advanced package selection, new generation product package structure, and configuration optimization.
Responsible for Package/SIP physical design and layout, optimization, DV, and tape out.
Work with multi-functional teams to achieve optimized mechanical, electrical, and thermal performance for various types of chips.
Implement the physical design of packages and modules for SoC.
Interface and coordinate with multi-functional groups throughout Qualcomm on new product package/SiP feasibility analysis, design, and selection.
Define and develop design verification and automation strategy to strengthen and streamline package design and release flows.
Work multi-functionally to optimize package pin out.
Ensure package design is optimized with SI/PI requirements.
Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
Explore, evaluate, and develop new CAD tools, design, and verification flow.
Partner with BU PD team to optimize chip Floorplan and bump placement and optimize the package size.

Requirements

Proficient in Cadence APD & SiP and/or Siemens Xpedition Package Designer (xPD).
Familiar in using Constraint Manager in Package design tool for setting up DFM rules and electrical rules
Experience in using in-line DRC checking, DFM verification, Electrical Rule Checking (ERC) preferred.
Basic knowledge in signal-integrity for high-speed IO interfaces, transmission line & electromagnetic field theory.
Knowledge of IC packaging structures, chip-package, and package-board interaction.
Basic knowledge of electronic packaging process and typical failure modes preferred.
Master's degree in electrical engineering, mechanical engineering, material science, or related fields with 5+ years of experience.
Proven fundamentals in electrical, material, thermal, or mechanical engineering fields.
Familiarity with various sophisticated package configurations and assembly/substrate technology (Flip chip BGA, 2.5D/3D Interposer, etc.).
Experience in package design and proficiency in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP).
Basic understanding of some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.
Basic knowledge of substrate manufacturing process, structure, design rules, and material properties.
Proven understanding of high-speed interfaces, including DDR, PCIe, UCIE, etc.
Experience with Calibre tool and package design reviews.
Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs).
Solid understanding of Design Rules Check and Design for Manufacturing.

Benefits

Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package designed to support your success at work, at home, and at play

Skills

Cadence APD & SiPSiemens Xpedition Package DesignerConstraint ManagerDRCDFM verificationERCSignal IntegrityTransmission Line TheoryElectromagnetic Field TheoryIC PackagingChip-Package InteractionPackage-Board InteractionCadence AllegroPCB EditorAdvanced Package DesignerXtractIMPowerSIHFSSQ3DS-parametersRLGCDDRPCIeUCIeCalibre

#Package Design#Packaging Engineering#SoC#Data Center#Server Solution#High Performance#Energy Efficient#Cadence#Siemens Xpedition#DFM#ERC#Signal Integrity#Electromagnetic Field Theory#IC Packaging#Chip-Package Interaction#Package-Board Interaction#Allegro#PCB#Advanced Package Designer#XtractIM#PowerSI#HFSS#Q3D#S-parameters#RLGC#DDR#PCIe#UCIe#Calibre