Packaging Technology Integration, Senior Staff Engineer
Technology, Data & Digital · Software & Web Development · Software Engineering
In short
Join a team focused on RF Front End Modules as a Senior Staff Engineer specializing in Packaging Technology Integration. This role involves end-to-end ownership of packaging technology from development through high volume manufacturing, ensuring robust and scalable solutions for cellular and wireless data markets.
Responsibilities
- Act as a senior technical lead in a global, cross-functional matrix.
- Drive development and integration of Si and GaAs packaging processes.
- Lead and qualify wafer singulation technologies.
- Drive substrate and assembly solutions for RF SiP applications.
- Own end-to-end technology integration into products, including risk assessment and mitigation.
- Develop and maintain packaging design rules aligned with manufacturing and reliability constraints.
- Serve as the technical interface to OSATs, leading technology transfer and qualification.
- Drive yield, quality, throughput, and reliability improvements.
- Lead failure analysis, root cause resolution, and reliability learning.
- Support customer NPQ, RMA analysis, and direct customer technical communication.
- Explore and evaluate future 2.5D packaging technologies.
Requirements
- Master’s degree in mechanical, Materials, Chemical, or Electrical Engineering; PhD preferred.
- 10+ years’ experience in semiconductor packaging, preferably RF modules / SiP.
- Demonstrated ownership across technology development, NPI, HVM, and customer support.
- Hands-on experience in wafer pre-assembly / wafer BE, including Cu pillar or micro-bump bumping, wafer singulation, and die sort.
- Demonstrated ability to debug and resolve wafer-level yield, die integrity, and reliability issues.
- Strong understanding of packaging materials, process interactions, failure mechanisms, and reliability.
- Hands-on experience with tier-1 foundries and OSATs.
- Working knowledge of industry standards (IPC, JEDEC, IEEE, ISO, ANSI).
- Experience in qualification, reliability testing, and failure analysis.
- Solid foundation in statistics, SPC, and FMEA.
- Strong cross-functional communication and leadership skills.
- Willingness to travel internationally (~once per quarter).
Desired Qualifications
- Bachelor's degree in engineering or related field and 6+ years of relevant experience; or
- Master's degree in engineering or related field and 5+ years of relevant experience; or
- PhD in Engineering or related field and 4+ years of relevant experience.
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
- Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
- PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
Benefits
- Qualcomm is an equal opportunity employer.
- Commitment to providing an accessible process for individuals with disabilities.
- Reasonable accommodations provided to support individuals with disabilities.
- Commitment to making the workplace accessible for individuals with disabilities.
Skills
RDLCu pillar bumpingstealth dicingplasma dicingSPCFMEADOEIPCJEDECIEEEISOANSI
#RF#Modules#Engineering#Semiconductor#Packaging#Hardware#NPI#HVM#OSAT
About Qualcomm
Enabling a world where everyone and everything can be intelligently connected.
Enabling a world where everyone and everything can be intelligently connected.\n\n
Company
QualcommJob Posted
17 hours ago
Employment Type
Full Time
Work mode
On Site
Experience Level
Senior
Locations
Singapore, Singapore
Qualification
Master, Doctoral
Applicants
Be an early applicant
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