Packaging Technology Integration, Senior Staff Engineer
Technology, Data & Digital · Software & Web Development · Software Engineering
In short
Join a team focused on RF Front End Modules as a Senior Staff Engineer specializing in Packaging Technology Integration. This role involves end-to-end ownership of packaging technology from development through high volume manufacturing, ensuring robust and scalable solutions for cellular and wireless data markets.
Responsibilities
- Act as a senior technical lead in a global, cross-functional matrix.
- Drive development and integration of Si and GaAs packaging processes.
- Lead and qualify wafer singulation technologies.
- Drive substrate and assembly solutions for RF SiP applications.
- Own end-to-end technology integration into products, including risk assessment and mitigation.
- Develop and maintain packaging design rules aligned with manufacturing and reliability constraints.
- Serve as the technical interface to OSATs, leading technology transfer and qualification.
- Drive yield, quality, throughput, and reliability improvements.
- Lead failure analysis, root cause resolution, and reliability learning.
- Support customer NPQ, RMA analysis, and direct customer technical communication.
- Explore and evaluate future 2.5D packaging technologies.
Requirements
- Master’s degree in mechanical, Materials, Chemical, or Electrical Engineering; PhD preferred.
- 10+ years’ experience in semiconductor packaging, preferably RF modules / SiP.
- Demonstrated ownership across technology development, NPI, HVM, and customer support.
- Hands-on experience in wafer pre-assembly / wafer BE, including Cu pillar or micro-bump bumping, wafer singulation, and die sort.
- Demonstrated ability to debug and resolve wafer-level yield, die integrity, and reliability issues.
- Strong understanding of packaging materials, process interactions, failure mechanisms, and reliability.
- Hands-on experience with tier-1 foundries and OSATs.
- Working knowledge of industry standards (IPC, JEDEC, IEEE, ISO, ANSI).
- Experience in qualification, reliability testing, and failure analysis.
- Solid foundation in statistics, SPC, and FMEA.
- Strong cross-functional communication and leadership skills.
- Willingness to travel internationally (~once per quarter).
Desired Qualifications
- Bachelor's degree in engineering or related field and 6+ years of relevant experience; or
- Master's degree in engineering or related field and 5+ years of relevant experience; or
- PhD in Engineering or related field and 4+ years of relevant experience.
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
- Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
- PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
Benefits
- Qualcomm is an equal opportunity employer.
- Commitment to providing an accessible process for individuals with disabilities.
- Reasonable accommodations provided to support individuals with disabilities.
- Commitment to making the workplace accessible for individuals with disabilities.
Skills
RDLCu pillar bumpingstealth dicingplasma dicingSPCFMEADOEIPCJEDECIEEEISOANSI
#RF#Modules#Engineering#Semiconductor#Packaging#Hardware#NPI#HVM#OSAT
About Qualcomm
Enabling a world where everyone and everything can be intelligently connected.
Enabling a world where everyone and everything can be intelligently connected.\n\n
Company
QualcommJob Posted
7 hours ago
Employment Type
Full Time
Work mode
On Site
Experience Level
Senior
Locations
Singapore, Singapore
Qualification
Master, Doctoral
Applicants
Be an early applicant
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