Package Design Engineer - Staff

Teknik, data och digitalt · Mjukvaru- och webbutveckling · Mjukvaruutveckling

I korthet

Qualcomm's Data Center team is seeking a highly talented Staff Package Design Engineer to develop high-performance, energy-efficient server solutions. The role involves driving advanced package selection, physical design, optimization, and working with multi-functional teams to achieve superior mechanical, electrical, and thermal performance for various chip types.

Ansvarsområden

Own and drive advanced package selection, new generation product package structure, and configuration optimization.
Responsible for Package/SIP physical design and layout, optimization, DV, and tape out.
Work with multi-functional teams to achieve optimized mechanical, electrical, and thermal performance for various types of chips.
Implement the physical design of packages and modules for SoC.
Interface and coordinate with multi-functional groups throughout Qualcomm on new product package/SiP feasibility analysis, design, and selection.
Define and develop design verification and automation strategy to strengthen and streamline package design and release flows.
Work multi-functionally to optimize package pin out.
Ensure package design is optimized with SI/PI requirements.
Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
Explore, evaluate, and develop new CAD tools, design, and verification flow.
Partner with BU PD team to optimize chip Floorplan and bump placement and optimize the package size.

Krav

Proficient in Cadence APD & SiP and/or Siemens Xpedition Package Designer (xPD).
Familiar in using Constraint Manager in Package design tool for setting up DFM rules and electrical rules
Experience in using in-line DRC checking, DFM verification, Electrical Rule Checking (ERC) preferred.
Basic knowledge in signal-integrity for high-speed IO interfaces, transmission line & electromagnetic field theory.
Knowledge of IC packaging structures, chip-package, and package-board interaction.

Önskade kvalifikationer

Master's degree in electrical engineering, mechanical engineering, material science, or related fields with 5+ years of experience.
Proven fundamentals in electrical, material, thermal, or mechanical engineering fields.
Familiarity with various sophisticated package configurations and assembly/substrate technology (Flip chip BGA, 2.5D/3D Interposer, etc.).
Experience in package design and proficiency in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP).
Basic understanding of some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.
Basic knowledge of substrate manufacturing process, structure, design rules, and material properties.
Proven understanding of high-speed interfaces, including DDR, PCIe, UCIE, etc.
Experience with Calibre tool and package design reviews.
Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs).
Solid understanding of Design Rules Check and Design for Manufacturing.

Förmåner

Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package designed to support your success at work, at home, and at play.

Färdigheter

Cadence APD & SiPSiemens Xpedition Package DesignerConstraint ManagerDFMERCSignal IntegrityTransmission Line TheoryElectromagnetic Field TheoryIC Packaging StructuresChip-Package InteractionPackage-Board InteractionCadence AllegroPCB EditorAdvanced Package DesignerXtractIMPowerSIHFSSQ3DS-parametersRLGC modelSubstrate Manufacturing ProcessDDRPCIeUCIECalibreCrosstalk MitigationDifferential PairsDesign Rules Check

#Data Center#Server Solution#High Performance#Energy Efficient#Package Design#SoC#CAD tools#Design Verification#Automation#SI/PI