Sr. Director, AI Technology & Manufacturing
Manufacturing & Production · Production & Assembly · Manufacturing Engineering
In short
Qualcomm is looking for a Sr. Director, AI Technology & Manufacturing to lead the expansion of its technology and manufacturing agenda within GMTO. This role will integrate efforts across silicon, packaging, substrates, and more to create an executable roadmap. The position requires deep semiconductor expertise and cross-functional leadership to support business units like Datacenter and Automotive.
Responsibilities
- Lead Qualcomm's datacenter and module technology and manufacturing agenda within GMTO across test, packaging, substrates, memory, power, thermal, and system development.
- Develop and own an integrated STCO roadmap across silicon, package, power, and thermal, aligned with business unit product plans.
- Translate long-range business unit requirements into actionable technology, manufacturing, capacity, and capability plans.
- Drive qualification through scale for key datacenter technologies.
- Drive execution to secure required capacity across advanced-node wafer, substrates, OSAT/CM, and memory.
- Execute supply-chain assurance investment across memory, OSAT/test, and substrates with capital and cost discipline.
- Build effective relationships across the foundry, OSAT, substrate, and memory supplier ecosystem.
- Lead the stand-up and scaling of Qualcomm's datacenter test capability.
- Establish robust strategies for burn-in, system-level test, and thermal management for server-class products.
- Ensure technology and manufacturing readiness through qualification and volume ramp.
- Create strong alignment and clear operating interfaces across GMTO, Datacenter BU, and Qualcomm Engineering organizations.
- Establish clear accountability and decision-making mechanisms.
- Build a sustainable joint planning cadence with the Datacenter and automotive Business units.
- Lead through a matrixed organization, supported by a small direct core team.
Requirements
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 10+ years of Hardware Engineering or related work experience.
- OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 9+ years of Hardware Engineering or related work experience.
- OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 8+ years of Hardware Engineering or related work experience.
Desired Qualifications
- 8+ years of leadership experience in Data Center Industry, semiconductor development, test and manufacturing, including leadership at the Director level.
- Knowledge of datacenter customer requirements and rack-scale infrastructure.
- Demonstrated experience delivering complex server-class systems from concept through volume production.
- Deep understanding of semiconductor product development and manufacturing environments.
- Established relationships across foundry, OSAT, substrate and memory suppliers, including experience with multi-year capacity negotiations.
- Technical expertise in areas such as burn-in, system-level test, thermal management, advanced packaging and server-class manufacturing.
- Enterprise and cross-functional leadership: Ability to mobilize teams and drive outcomes across organizational boundaries.
- Technical depth: Strong semiconductor and manufacturing knowledge combined with the ability to communicate effectively at executive level.
- Strategic execution: Ability to translate complex, multi-year technology requirements into executable roadmaps and near-term decisions.
- Capital and cost discipline: Focus on business outcomes and capacity secured relative to capital committed.
- Capability building: Demonstrated ability to establish and scale new technical and operational capabilities in fast-moving environments.
- Influence in a matrix: Ability to create alignment and accountability across multiple functions without relying solely on direct organizational authority.
Benefits
- Competitive annual discretionary bonus program.
- Opportunity for annual RSU grants.
- Highly competitive benefits package designed to support your success at work, at home, and at play.
- Approximately 60-70% travel requirement.
Skills
Hardware EngineeringSemiconductor DevelopmentThermal ManagementPackagingSystem DevelopmentAI
#AI#Technology#Manufacturing#Semiconductor#Datacenter#Automotive#Hardware Engineering#Director
About Qualcomm
Enabling a world where everyone and everything can be intelligently connected.
Enabling a world where everyone and everything can be intelligently connected.\n\n
Company
QualcommJob Posted
2 weeks ago
Employment Type
Full Time
Work mode
On Site
Salary
US$251,700–377,500 · Negotiable
Experience Level
Director
Locations
San Diego, United States of America
Qualification
Bachelor, Master, Doctoral, Undergraduate
Applicants
Be an early applicant
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