Solution Architect

Manufacturing & Production · Production & Assembly · Manufacturing Engineering

In short

The OSAT Interface Manager is the primary technical and program contact for OSAT partners in semiconductor package development, assembly, testing, qualification, yield improvement, and production readiness. This role manages the end-to-end OSAT engagement to ensure all activities meet product requirements, quality standards, schedule, and cost objectives.

Responsibilities

Act as the primary technical interface with OSAT partners.
Define and communicate package, assembly, and test requirements.
Review OSAT process capabilities against product requirements.
Drive resolution of technical issues during package development and production.
Support package selection and development (QFN, QFP, BGA).
Define and review assembly requirements (die attach, wire bonding, molding, etc.).
Manage OSAT activities from package definition through NPI builds and production release.
Coordinate OSAT assembly and final test activities.
Define and review test requirements and test flow.
Monitor assembly and test yield.
Coordinate package qualification and reliability activities.
Develop and track qualification plans, schedules, and reports.
Support AEC-Q100 qualification for automotive products.
Monitor OSAT assembly and test yields and establish improvement plans.
Lead OSAT failure analysis and corrective-action activities.
Drive 8D/root-cause analysis for major quality issues.
Manage OSAT project schedules, milestones, and deliverables.
Track OSAT NRE, tooling, assembly, and test costs.
Support OSAT capacity planning and production ramp.
Participate in technical and commercial discussions with OSAT partners.
Maintain OSAT risk and issue registers.
Escalate critical technical, quality, cost, and schedule issues.

Requirements

20+ years of experience in semiconductor packaging, assembly, product engineering, test, or OSAT operations.
Strong experience working directly with OSAT organizations.
Experience with package technologies such as QFN, QFP, BGA or similar packages.
Strong understanding of die attach, wire bonding, molding, leadframe/substrate, singulation, package inspection, final test, and reliability qualification.
Experience managing semiconductor NPI programs.
Experience in yield improvement and semiconductor failure analysis.
Strong cross-functional communication and program-management skills.

Desired Qualifications

Automotive semiconductor/AEC-Q100 experience is desirable.
Experience with automotive semiconductor products.
Experience working with OSATs such as ASE, Amkor, JCET, UTAC, SPIL or equivalent.
Experience with QFN/QFP packages and wire-bond assembly.
Experience taking semiconductor products from engineering build through qualification and production ramp.
Ability to work across engineering, quality, procurement, operations, and customer teams.

Benefits

Supercharge your potential at HCLTech.
Find your career at HCLTech.
Find your spark at HCLTech.
HCLTech is a global technology company with over 230,000 people across 60 countries.
Delivering industry-leading capabilities centered around digital, engineering, cloud, and AI.
Work with clients across all major verticals: Financial Services, Manufacturing, Life Sciences & Healthcare, Technology & Services, Telecom & Media, Retail & CPG, and Public Services.

Skills

QFNQFPBGADie attachWire bondingMoldingSingulationPackage inspectionFinal testReliability qualificationAEC-Q1008D

#OSAT#Semiconductor Package Development#Assembly#Testing#Qualification#Yield Improvement#Production Readiness#NPI#Reliability#Failure Analysis#8D#AEC-Q100#Automotive Semiconductor

About HCLTech

Supercharging progress through technology and innovation

HCLTech is a global technology company, home to 219,000+ people across 54 countries, delivering industry-leading capabilities centered around digital, engineering and cloud, powered by a broad portfolio of technology services and products. We work with clients across all major verticals, providing industry solutions for Financial Services, Manufacturing, Life Sciences and Healthcare, Technology and Services, Telecom and Media, Retail and CPG, and Public Services. Consolidated revenues as of 12 months ending September 2022 totaled $12.1 billion. To learn how we can supercharge progress for…

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