Principal Package Engineer
Technology, Data & Digital · Software & Web Development · Software Engineering · Embedded Systems
In short
Microsoft seeks a Principal Package Engineer to drive advanced silicon packaging technology selection, qualification, and manufacturing for Azure cloud infrastructure. This hybrid role requires expertise in chiplet architecture, 2.5D/3D packaging, and supplier management to support the product roadmap and ensure quality and reliability.
Responsibilities
- Drive optimal silicon packaging solution supporting Azure datacenter product roadmap.
- Drive package technology for chiplet architecture with advanced 2.5D/3D packaging.
- Drive 2.5D/3D packaging product designs (bridge/interposer/substrate) from definition, development to tapeout.
- Define, design and develop test vehicles to validate Silicon, Package, System performance.
- Drive supplier assessments and manage suppliers through definition, development, qualification and production.
- Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options.
- Define EDA tools requirements for advanced 3DIC packaging designs.
- Design and develop package and assembly drawings to support the manufacturing.
- Assess and characterize the reliability of Integrated Circuits (IC) packages.
- Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
- Drive execution of architecture solutions across product lines or multiple product groups and across teams.
- Drive engineering system design decisions that require collaboration between internal and external stakeholders.
- Develop system models based on current and anticipated feature/design needs and trade-offs.
Requirements
- Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.
- Ability to meet Microsoft, customer and/or government security screening requirements.
- Pass the Microsoft Cloud Background Check.
- Eligibility to access export-controlled information.
Desired Qualifications
- Doctorate in Electrical Engineering, Physics, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR Master's Degree in Electrical Engineering, Physics, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Physics, Computer Engineering, Computer Science, or related field AND 12+ years technical engineering experience OR equivalent experience.
- 15+ years of hands-on experience in Semiconductor Package design, development, manufacturing, supplier management or quality management.
- Specific experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D).
- Foundation in advanced packaging technologies, manufacturing and supplier management.
- Working knowledge in high-speed signaling, layout, electrical, mechanical and thermal co-designs.
- Working knowledge in defining test vehicle strategies.
- Experience in thermo-mechanical FEA, with the ability to translate simulation results into product design requirements.
- Working knowledge in 2D and 3D simulation tools for full package layout extractions for power and signals analysis.
- Experience with OSAT, Supplier & Foundry technologies.
- Experience in physical failure analysis.
- Experience in subcontract supplier management.
- Record of success in cross-functional team environment.
Benefits
- Base pay range (US): $142,800 - $274,800 per year.
- Base pay range (SF Bay Area/NYC): $188,000 - $304,200 per year.
- Eligible for benefits and other compensation.
Skills
Electrical EngineeringComputer EngineeringComputer ScienceSemiconductor Package design2.5D/3D packagingFMEAFEA
#Silicon Engineering#Hardware Engineering#Cloud Infrastructure#Azure#Cobalt
About Microsoft
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Every company has a mission. What's ours? To empower every person and every organization to achieve more. We believe technology can and should be a force for good and that meaningful innovation contributes to a brighter world in the future and today. Our culture doesn’t just encourage curiosity; it embraces it. Each day we make progress together by showing up as our authentic selves. We show up with a learn-it-all mentality. We show up cheering on others, knowing their success doesn't diminish our own. We show up every day open to learning our own biases, changing our behavior, and inviting…
Company
MicrosoftJob Posted
3 days ago
Employment Type
Full Time
Work mode
Hybrid
Salary
US$142,800–274,800 / year
Experience Level
Senior
Locations
United States
Qualification
Doctoral, Master, Bachelor
Applicants
Be an early applicant
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