Modem HW Design Engineer – AI Driven Next Gen Modem Hardware Development
Technology, Data & Digital · Software & Web Development · Software Engineering · Embedded Systems
In short
Qualcomm is looking for a skilled Modem Hardware Design Engineer to join their team in San Diego, California. This role focuses on AI-driven methodologies and next-generation modem hardware development, utilizing GenAI, ML, and agentic-AI automation frameworks. The engineer will be responsible for defining specifications, developing RTL, and optimizing designs in collaboration with cross-functional teams.
Responsibilities
- Define specifications and architecture/micro-architecture.
- Develop RTL.
- Optimize for area, power, and performance.
- Collaborate within the hardware team (verification, modeling, physical implementation).
- Engage with system, RF, firmware, and software teams to deliver first-time-right silicon.
Requirements
- Bachelor's degree in Computer Engineering, Computer Science, Electrical Engineering, or related field and 4+ years of relevant work experience.
- Master's degree in Computer Engineering, Computer Science, Electrical Engineering, or related field and 3+ years of relevant work experience.
- PhD in Computer Engineering, Computer Science, Electrical Engineering, or related field and 2+ years of relevant work experience.
- BS or MS degree and 5+ years of relevant industry experience.
- Strong expertise in RTL coding and logic design for wireless modem ASICs or custom datapath components for DSP applications.
- Solid understanding of Verilog, SystemVerilog, C/C++, and SystemC.
- Experience with synthesis, industry LINT, clock domain crossing, low power design and verification.
- Background in wireless/wireline modem technology, DSP, or communication systems.
- Experience with Generative AI, ML, or agentic-AI‑based automation.
- Proficiency with Unix/Linux shell scripting, Python/Perl, Makefiles, XML.
- Excellent communication, collaboration, and critical‑thinking skills.
Desired Qualifications
- Knowledge of 4G/5G 3GPP physical layer standards is a strong plus.
- Ultra-deep sub-micron CMOS technology nodes such as 4nm and below.
Benefits
- Competitive annual discretionary bonus program.
- Opportunity for annual RSU grants.
- Highly competitive benefits package designed to support success at work, at home, and at play.
Skills
VerilogSystemVerilogC/C++SystemCPythonPerlGenAIML
#Modem#Hardware#Design#Engineer#AI#Next Gen#Modem Hardware#Development#Qualcomm#Semiconductor#Wireless Innovation#6G#Modem RF#Transceiver#RTL#Logic Design#ASIC#Datapath#DSP#Verilog#SystemVerilog#C/C++#SystemC#Synthesis#LINT#Clock Domain Crossing#Low Power Design#Wireless#Wireline#Communication Systems#4G/5G#3GPP#Physical Layer#CMOS#Generative AI#ML-assisted#Agentic-AI#Automation#Unix/Linux#Shell Scripting#Python#Perl#Makefiles#XML#Communication#Collaboration#Critical-Thinking
Enabling a world where everyone and everything can be intelligently connected.\n\n
Company
QualcommJob Posted
3 weeks ago
Employment Type
Full Time
Work mode
On Site
Salary
US$162,500–243,700 / year
Experience Level
Mid-Senior
Locations
San Diego, United States of America
Qualification
Bachelor, Master, Doctoral
Applicants
Be an early applicant
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