Senior Designer

Technology, Data & Digital · Software & Web Development · Software Engineering

In short

As a Senior Package Design Engineer with 5+ years of experience, you will be responsible for IC package design using Cadence APD, focusing on high-speed complex designs and adhering to DFM/DFA rules. You will also mentor junior designers and collaborate with cross-functional teams to ensure project alignment and quality.

Responsibilities

Work closely with stakeholders to understand and refine design requirements.
Develop prototypes and proof-of-concept implementations to validate design decisions.
Mentor junior designers, share knowledge and expertise through training sessions and documentation.
Collaborate with cross functional teams and other stakeholders to align software design with overall project goals.
Work with quality assurance teams to establish and maintain high-quality.

Requirements

IC Package Design Engineer with 5+ years of experience.
Experience with Cadence Advanced Package Designer (APD) tool.
Good understanding of package/substrate design and package assembly rules related to flip chip designs.
Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies.
Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, LPDDR, GDDR and HSIO interfaces including PCIe, SERDES.
Good Exposure to Stackup design, DFM, DFA rules and adherence.
Expertise in constraint setting in layout tool.
Good Oral and Written communication skills.

Desired Qualifications

Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D is an added advantage.

Benefits

Supercharge your potential.
Find your career.
Find your spark.
A place that knows that helping its customers stay on top starts by putting its people first.

Skills

Cadence Advanced Package DesignerIC Package DesignPackage Layout DesignProbe Card Substrate DesignDFMDFAPCB DesignHDIDDRLPDDRGDDRPCIeSERDES

#IC Package Design#Cadence APD#Flip Chip Designs#MCM#3D#2.5D#High-Speed Design#PCB Design#HDI#Blind and Buried Via#DDR#LPDDR#GDDR#HSIO#PCIe#SERDES#Stackup Design#DFM#DFA#Constraint Setting

About HCLTech

Supercharging progress through technology and innovation

HCLTech is a global technology company, home to 219,000+ people across 54 countries, delivering industry-leading capabilities centered around digital, engineering and cloud, powered by a broad portfolio of technology services and products. We work with clients across all major verticals, providing industry solutions for Financial Services, Manufacturing, Life Sciences and Healthcare, Technology and Services, Telecom and Media, Retail and CPG, and Public Services. Consolidated revenues as of 12 months ending September 2022 totaled $12.1 billion. To learn how we can supercharge progress for…

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