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Thermal Engineer, Staff

Bygg, teknik och hantverk · Bygg- och industriteknik · Maskinteknik

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Qualcomm is hiring a Staff Thermal Engineer in Hsinchu City, Taiwan, to address complex thermal management challenges for data center AI applications. This role involves creating advanced thermal architecture solutions for high-performance packages, utilizing analytical and empirical skills for both modeling and experimental validation.

Ansvarsområden

  • Perform package and system-level thermal modeling to maximize thermal performance of various packages.
  • Design, set up, run, and deliver results for various thermal experiments to validate hardware performance.
  • Manage technical projects and collaborate with internal organizations and OEMs/ODMs throughout the development cycle.
  • Perform thermal simulations and tests, preparing and presenting results to diverse stakeholders.

Krav

  • 8+ years of industry experience in electronics cooling, preferably related to data center packages and systems.
  • Expertise in conducting CFD simulations using tools such as ANSYS-Icepak, Flotherm, or Celsius-EC.
  • Hands-on experience enabling test hardware/platforms and executing test vectors for thermal validation and verification.
  • Ability to write scripts and perform data analysis; programming experience with Python, C/C++.
  • Debugging and bring-up experience, including operating data acquisition equipment.
  • Ability to design thermal tests and execute per plan in a laboratory environment.
  • Experience with selection of thermal management materials.
  • In-depth understanding of forced convection and liquid cooling.
  • Thermal design experience with PCBs, enclosures, and heat sinks.
  • Some experience with 3D geometry CAD tools such as Solidworks or Creo.
  • Excellent presentation, negotiation, and communication skills.

Önskade kvalifikationer

  • MSME or PhD in Mechanical Engineering.
  • Exposure to cooling systems related to the data center industry is a plus.

Förmåner

  • Opportunity to create innovative solutions for complex thermal management challenges in data center AI applications.
  • Work on the development of advanced thermal architecture solutions for high-performance packages.
#AI#data center#3DIC packages#heat transfer#CFD#ANSYS-Icepak#Flotherm#Celsius-EC#thermal management#thermal test#fans#natural convection#forced convection#radiation#conduction#liquid cooling
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Företag

Qualcomm

Publicerade jobb

för 2 veckor sedan

Anställningstyp

Heltid

Arbetsform

På plats

Erfarenhetsnivå

Mellannivå

Platser

Hsinchu City, Taiwan

Kvalifikation

Masterexamen, Doktorand, Kandidatexamen

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