Sr Architect, Technical Product Manager (3DIC Packaging)
Teknik, data och digitalt · Mjukvaru- och webbutveckling · Mjukvaruutveckling · Produktledning
I korthet
Synopsys is looking for a senior Technical Product Manager with extensive experience in IC packaging design and analysis to drive the roadmap for advanced multi-die package solutions. This role involves translating customer needs and market trends into product requirements and collaborating with engineering teams to deliver innovative packaging technologies for AI and high-performance computing.
Ansvarsområden
- Develop the technical roadmap for multi-die advanced package design, implementation, and signoff analysis.
- Engage with customers, foundries, and OSATs to translate packaging challenges into prioritized requirements.
- Evaluate the competitive landscape, emerging technologies, and evolving design methodologies to guide roadmap priorities and position Synopsys offerings.
- Work hands-on with engineering teams to define capabilities, evaluate technical tradeoffs, and validate solutions across silicon, advanced package, and package substrate flows.
- Drive cross-functional delivery of solutions addressing package implementation, SI/PI, multiphysics, and manufacturing challenges.
- Advance AI-driven and agentic workflows for multi-die design, multiphysics analysis, and optimization.
- Present the technical product vision and roadmap to executives, customers, and ecosystem partners, and represent Synopsys at industry events and standards engagements.
- Provide technical direction to field teams supporting customer evaluations and deployments.
Krav
- 15+ years of semiconductor IC and packaging experience.
- Deep technical knowledge of IC and package design, analysis, manufacturing, and production tapeout.
- Hands-on expertise with industry-standard silicon and package design tools, SI/PI analysis tools, and related production flows.
- Expertise in signal integrity, power integrity, EMIR, thermal, and mechanical analysis for advanced packages.
- Experience with 2.5D/3DIC, chiplet, HBM, photonics, and co-packaged optics architectures & methodologies.
- Familiarity with high-speed interfaces such as PCIe, DDR, and HBM in the context of package design & signoff.
- Understanding of AI-driven and agentic workflows for design automation, analysis, and optimization.
- Experience working with semiconductor companies, hyperscalers, foundries, OSATs, and ecosystem partners.
- Demonstrated ability to translate complex technical challenges into requirements and roadmap priorities.
Förmåner
- Eligible for an annual bonus, equity, and other discretionary bonuses.
- Comprehensive health, wellness, and financial benefits as part of a competitive total rewards package.
#3DIC Packaging#Technical Product Management#IC Design#Semiconductor
Företag
Synopsys Inc
Publicerade jobb
för 1 vecka sedan
Anställningstyp
Heltid
Arbetsform
På plats
Erfarenhetsnivå
Senior
Platser
Austin, United States
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