Principal Optical Packaging Engineer

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I korthet

Microsoft Research seeks an experienced Principal Optical Packaging Engineer to lead the architecture and assembly strategy for emerging optical interconnect and co-packaged optics technologies. This role involves working with a multidisciplinary team to translate system requirements into package architectures and specifications, bridging the gap between research prototypes and deployable infrastructure.

Ansvarsområden

Shape next-generation optical and advanced packaging technologies for AI infrastructure and high-performance computing.
Work at the intersection of optics, photonics, semiconductor packaging, silicon, networking, and AI system design.
Influence package architectures integrating photonic devices, electronic ICs, ASICs/chiplets, interposers, optical interfaces, and thermal solutions.
Collaborate across research, engineering, sourcing, manufacturing, and product teams, as well as with industry partners.
Help move technologies across the complete lifecycle, from architecture and prototype development through supplier qualification and production readiness.
Translate advanced research and packaging innovation into scalable technologies with real-world product impact.

Krav

Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Optical Engineering, Physics, or a related technical field, or equivalent practical experience.
5+ years of industry experience in advanced semiconductor packaging, optical/photonics packaging, heterogeneous integration, electronic packaging, or related hardware technologies.
Experience in advanced packaging and assembly, in one or more of the following areas: 2.5D/3D integration, interposers/RDL, fine-pitch interconnects, die attach/bonding, underfill, moulding, adhesives, and thermal management.
Experience integrating optical/photonics devices with electronic ICs and package structures, with an understanding of several of the following: optical coupling and alignment, electrical interconnects, thermal/mechanical behaviour, package reliability, and manufacturability.
Hands-on experience in one or more stages of the package development and productisation lifecycle, including process characterisation, design validation, reliability qualification, failure analysis, DFM, and manufacturing readiness.
Experience working with one or more types of external manufacturing or technology partner, such as foundries, OSATs, optical component/module suppliers, equipment suppliers, or material suppliers, including activities such as technical assessments or manufacturing-readiness reviews.

Önskade kvalifikationer

Master’s degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Optical Engineering, Physics, or a related technical discipline.
Experience with co-packaged optics (CPO), optical I/O, silicon photonics, optical engines, lasers, or high-speed optical interconnects.
Experience with advanced packaging technologies such as CoWoS, SoIC, EMIB, fan-out packaging, chiplet integration, wafer-level packaging, or interposer-based heterogeneous integration.
Experience with fibre attach, active/passive optical alignment, optical coupling, lens integration, alignment tolerance analysis, or optical link-budget evaluation.
Knowledge of package thermal-mechanical behaviour and reliability, including stress, warpage, thermal expansion, heat dissipation, adhesion, delamination, and related failure mechanisms.
Experience developing technologies for AI infrastructure, high-performance computing, high-speed networking, datacentre systems, or other high-bandwidth applications.

Förmåner

Certain roles may be eligible for benefits and other compensation.
Find additional benefits and pay information here: https://careers.microsoft.com/v2/global/en/corporate-pay/united-kingdom-corporate-pay.html

Färdigheter

PhotonicsSemiconductor PackagingAIOptical IntegrationHeterogeneous IntegrationElectrical EngineeringMechanical EngineeringMaterials ScienceOptical EngineeringPhysics2.5D/3D integrationInterposersRDLDie attachBondingUnderfillMouldingAdhesivesThermal ManagementOptical CouplingElectrical InterconnectsPackage ReliabilityDFMCo-packaged opticsSilicon photonicsOptical enginesLasersHigh-speed optical interconnectsWafer-level packagingChiplet integrationFibre attachActive/passive optical alignmentOptical link-budget evaluationHigh-performance computingNetworking

#AI infrastructure#high-performance computing#optical interconnects#co-packaged optics#semiconductor packaging#photonics#research

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Företag

Microsoft

Publicerade jobb

för 2 dagar sedan

Anställningstyp

Heltid

Arbetsform

Hybrid

Lön

74 700–161 800 GBP · Förhandlingsbar

Erfarenhetsnivå

Senior

Platser

United Kingdom

Kvalifikation

Kandidatexamen

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