The Job

Principal IC Packaging Engineer

Teknik, data och digitalt · Mjukvaru- och webbutveckling · Mjukvaruutveckling

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Qualcomm is looking for a Principal IC Packaging Engineer to lead the development of advanced IC packaging technologies for Data Center AI and Power Management. The role involves driving innovation from concept to manufacturing, requiring expertise in various packaging methods and materials, and leading cross-functional teams with OSAT providers.

Ansvarsområden

  • Provide leadership and take responsibility for the development of advanced packaging technologies, including wafer bonding, RDL, 3D, wafer dicing, and 2.5D packaging.
  • Oversee new product introductions and ensure smooth transition to high-volume manufacturing.
  • Leverage subject matter expertise in package architecture, high-density interconnect package design, as well as performance, reliability, and cost constraints.
  • Apply hands-on experience in packaging assembly processes, materials, equipment, and adherence to design rules.
  • Collaborate with and manage multiple foundries and OSATs to advance packaging solutions from concept to full-scale production.
  • Lead cross-functional teams and manage multiple concurrent programs.
  • Resolve complex technical issues encountered throughout the development and manufacturing process.

Krav

  • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
  • Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
  • PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.
  • Seventeen or more years of hands-on experience in packaging technology development, specifically in 2.5D/3D for high-density die-to-die (D2D) interconnects, RDL, fan-out bridges, FCBGA, MCM, and related disciplines.
  • Comprehensive understanding of semiconductor industry packaging trends, end-user packaging requirements, and prior experience with high-performance computing products.
  • Familiarity with reliability standards, test methods, qualification procedures, and failure analysis techniques.
  • Knowledge of substrate manufacturing processes and design rules.
  • Excellent verbal and written communication skills.
  • Demonstrated ability in organized technical project management.
  • Ability to work independently and lead multiple programs simultaneously.
  • Proven capability to lead multi-functional teams and resolve complex technical problems.

Önskade kvalifikationer

  • M.S. or Ph.D. in Mechanical, Electrical, or Materials Engineering, or equivalent experience.
  • Familiarity with working alongside contract manufacturers (CM) on data center and rack design is considered an advantage.

Förmåner

  • Competitive annual discretionary bonus program
  • Opportunity for annual RSU grants
  • Highly competitive benefits package designed to support your success at work, at home, and at play.
#IC Packaging#Data Center AI#Power Management#RDL#wafer bonding#flip chip#wire bond#SiP#2.5D#3D
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Företag

Qualcomm

Publicerade jobb

för 1 månad sedan

Anställningstyp

Heltid

Arbetsform

På plats

Erfarenhetsnivå

Mellannivå

Platser

San Diego, United States of America

Kvalifikation

Kandidatexamen, Masterexamen, Doktorand

Sökande

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