The Job

Package Manufacturing Engineer, Senior to Staff Level (Kaohsiung or Taichung)

Tillverkning och produktion · Produktion och montering · Produktionsteknik · Förpackning

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I korthet

Qualcomm is seeking a Senior to Staff Level Package Manufacturing Engineer to support product development and advanced technologies in semiconductor packaging. The role involves cross-functional collaboration and requires deep understanding of packaging requirements, manufacturing processes, and quality concepts.

Ansvarsområden

  • Support development of products and advanced technologies for Qualcomm bumping, WLP, Flip Chip CSP & BGA, SiP module, EMIB, CoWoS, CPO, Data center, ASIC, SIP, Server, Rack, and 2.5/3D Chiplet applications.
  • Support product material and design selections, technical risk assessments, mitigation plans, and development from concept to production.
  • Develop a strong understanding of substrate and assembly process details, SPC, Control plans, OCAPs, FMEAs, PCN, CARs.
  • Work cross-functionally with Design, Device process development, internal and subcontract Packaging groups.

Krav

  • 10+ years of relevant work experience in Semiconductor (Packaging) Engineering or Manufacturing.
  • Deep understanding of packaging requirements, process capability and equipment capability throughout the industry and the ability to incorporate best engineering practices for all backend assembly process included automotive products requirements.
  • Familiar with excel, JMP data analysis tool.
  • Basic knowledge of excel VBA, Tableau software.
  • Good understanding of Chip level and package level reliability and failure analysis methodology.
  • Understand yield management, continuous improvement, assembly cycle time analysis and cost reduction.
  • Fluent in English and Mandarin, both spoken and written.
  • Proactive working attitude and capable to handle new challenge.

Önskade kvalifikationer

  • Good knowledge of quality concept and RMA process.
  • Basic knowledge of foundry process.
  • Good understanding of wafer bumping, laser grooving, wafer saw, Pick and place, underfill and Heat spread processes.
  • Good experience with yield management software (O+), JMP analysis tool.
  • Understand assembly and test house working model, turnkey model, supply chain and KPI.

Förmåner

  • Qualcomm is an equal opportunity employer.
#semiconductor#packaging#manufacturing#engineering#hardware
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Företag

Qualcomm

Publicerade jobb

för 1 vecka sedan

Anställningstyp

Heltid

Arbetsform

På plats

Erfarenhetsnivå

Senior

Platser

Kaohsiung, Taiwan

Taichung, Taiwan

Kvalifikation

Kandidatexamen, Masterexamen

Sökande

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