Design Lead

Teknik, data och digitalt · Mjukvaru- och webbutveckling · Mjukvaruutveckling

I korthet

HCLTech is seeking a Design Lead with expertise in Cadence APD IC Package/substrate Design, Flip Chip, and Wire Bond designs. The role involves working with high-speed interfaces, Signal and Power Integrity, and customer SPOCs independently. The position is based in Bangalore or Chennai.

Ansvarsområden

Design Lead
Experience with Cadence APD IC Package/substrate Design experience
Good experience with Flip Chip and Wire Bond designs
Worked from Die pin list to Tape out
Good understanding of package fabrication and assembly rules related to flip chip designs.
Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage
Should have experience in working with High-speed interfaces such as PCIe, LPDDRx, GDDR, XGMII, etc.,
Good knowledge and understanding in Signal Integrity and Power Integrity requirements
Should be able to work with customer SPOC independently.
Good Exposure to Stackup design, DFM, DFA rules and adherence.

Krav

Signal Integrity toolExpertSpecifically, in Cadence Sigrity 2.5D and 3D-EM and Agilent ADS.
Power Integrity toolExpertSpecifically, in Cadence Sigrity 2.5D and 3D-EM and Hspice.
Allegro toolKnowledgeBasic knowledge in Viewing/Understanding the routing details and extracting quick reports.
Lab measurement equipmentGoodFamiliarity with Vector Network Analyzer (VNA) and Oscilloscopes.

Förmåner

At HCLTech, you'll supercharge your potential. You'll find your career. And you'll find your spark.
All at a place that knows that helping its customers stay on top starts by putting its people first.
HCLTech is a global technology company, home to more than 230,000 people across 60 countries, delivering industry-leading capabilities centered around digital, engineering, cloud and AI, powered by a broad portfolio of technology services and products.
We work with clients across all major verticals, providing industry solutions for Financial Services, Manufacturing, Life Sciences and Healthcare, Technology and Services, Telecom and Media, Retail and CPG, and Public Services.
Consolidated revenues as of 12 months ending September 2026 totaled $14.8 billion.

Färdigheter

Cadence APD IC Package/substrate DesignFlip ChipWire BondMCM3D package design2.5D package designPCIeLPDDRxGDDRXGMIISignal IntegrityPower IntegrityStackup designDFMDFACadence Sigrity 2.5DCadence Sigrity 3D-EMAgilent ADSHspiceAllegroVector Network Analyzer (VNA)Oscilloscopes

#design#lead#ic package#substrate design#flip chip#wire bond#3d#2.5d#high-speed interfaces#pcie#lpddrx#gddr#xgmii#signal integrity#power integrity#stackup#dfm#dfa#cadence#sigrity#ads#allegro#vna#oscilloscope

Om HCLTech

Supercharging progress through technology and innovation

HCLTech is a global technology company, home to 219,000+ people across 54 countries, delivering industry-leading capabilities centered around digital, engineering and cloud, powered by a broad portfolio of technology services and products. We work with clients across all major verticals, providing industry solutions for Financial Services, Manufacturing, Life Sciences and Healthcare, Technology and Services, Telecom and Media, Retail and CPG, and Public Services. Consolidated revenues as of 12 months ending September 2022 totaled $12.1 billion. To learn how we can supercharge progress for…

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