ASIC Customer Support Project Manager

Company:

Qualcomm China

Job Area:

Engineering Group, Engineering Group > Hardware Applications Engineering

General Summary:

Job Overview  

We are looking for a senior ASIC Customer Support Project Manager with rich IC project experience to take full ownership of global customer technical support projects. You will coordinate cross-functional internal teams, manage customer expectations, control project milestones, Identify high-risk technical escalations, drive and coordinate the resolution of which through collabration with stakeholder teams. Ensure on-time delivery of high-quality technical services for ASIC design customers. This position serves as the single point of contact for key customers and drives continuous improvement of the customer support system. This role will contribute to customer retention, service quality improvement, and strategic account growth.  

Key Responsibilities  

1. Act as the primary project owner and main liaison for key ASIC customers, manage the entire lifecycle of customer technical support projects, including demand confirmation, schedule planning, resource allocation, milestone tracking and project closure.

2. Lead the resolution of high-complexity ASIC technical escalations covering front-end synthesis, physical implementation, timing signoff, power integrity, physical verification and low-power design flows.

3. Coordinate cross-functional resources including backend engineering, EDA R&D, foundry interface, application engineering and QA teams to prioritize critical issues and avoid project delays on the customer side.

4. Identify project risks in advance, formulate mitigation plans, conduct regular risk reviews, and escalate major roadblocks to management in a timely manner.

5. Organize regular technical sync meetings with global customers, report issue progress, manage customer expectations, and maintain long-term stable strategic customer relationships.

6. Establish standardized project processes, track key performance indicators such as issue resolution cycle, on-time closure rate and customer satisfaction, and optimize the customer support workflow.

7. Summarize recurring technical problems, organize the output of FAQs, operation specifications and best practice documents, and reduce repeated support workload. 8. Assist in pre-sales technical project planning, evaluate service workload, quote support resources, and support key account business expansion.  

Required Qualifications  

1. Bachelor’s degree or above in Microelectronics, Electrical Engineering, Integrated Circuit Design or related majors.

2. More than 10 years of working experience in the semiconductor industry, with solid experience in ASIC design or customer technical project management.

3. In-depth understanding of the full ASIC implementation flow from netlist to GDSII, familiar with mainstream EDA tools and physical design challenges.

4. Proven track record of managing multiple parallel customer projects, strong milestone control and risk management capabilities.

5. Excellent cross-departmental coordination skills; capable of driving multiple engineering teams to deliver results under tight schedules.

6. Fluent oral and written English for regular communication with overseas customers.

7. Customer-oriented, good at conflict management, pressure resistance and end-to-end project delivery.

8. Familiar with project management methodologies and able to build standardized support processes.  

Preferred Qualifications  

1. Experience working in EDA vendors, IP suppliers, top design service companies or leading foundries.

2. Solid ASIC backend physical design background with hands-on P&R, timing closure or PV troubleshooting experience.

3. Experience supporting Data Center ASIC, AI accelerator, networking silicon, DPU, XPU, or custom silicon programs is highly preferred.

4. Experience supporting advanced-node (7nm/5nm) chip projects and handling high-priority escalations.

5. Familiar with Tcl/Python scripting and technical data statistics.

Minimum Qualifications:

• Bachelor's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 6+ years of Hardware Applications Engineering or Hardware Design experience or related work experience.
OR
Master's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 5+ years of Hardware Applications Engineering or Hardware Design experience or related work experience.
OR
PhD in Electrical/Electronics Engineering, Computer Engineering, or related field and 4+ years of Hardware Applications Engineering or Hardware Design experience or related work experience.

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