Advanced Packaging, Distinguished Architect
Teknik, data och digitalt · Mjukvaru- och webbutveckling · Mjukvaruutveckling · Inbyggda system
I korthet
Synopsys is looking for a Distinguished Architect to lead the development of advanced packaging solutions within their 3DIC Compiler platform. This role requires deep expertise in semiconductor physical design and software development, focusing on enabling next-generation multi-die systems for AI and high-performance computing.
Ansvarsområden
- Architect and drive package substrate design automation capabilities within the 3DIC Compiler platform.
- Design and implement production-grade algorithms for HDI substrate auto-routing, design rule checking, power delivery network analysis, and design for manufacturability.
- Build scalable C/C++ software for advanced packaging designs, including multi-die chiplets and heterogeneous integration.
- Partner with customers, product teams, and R&D to translate design bottlenecks into durable technical solutions.
- Lead architecture reviews and influence technical decisions across the 3DIC product portfolio.
- Mentor engineers and raise the bar on algorithmic rigor, performance, and software quality.
Krav
- Deep expertise in advanced packaging or package substrate design, routing, power delivery, and manufacturability.
- Proven experience building production software products at scale.
- Strong algorithmic foundation for physical design automation challenges.
- Expert-level C/C++ skills for performance-critical, large-scale systems.
- Experience in at least one related domain: custom IC design automation, auto-routing, physical verification, or substrate design tools.
- Advanced degree in Computer Science, Electrical Engineering, or equivalent hands-on R&D experience.
- Track record of technical leadership through architecture ownership, product influence, publications, or patents.
Önskade kvalifikationer
- You think deeply about algorithms and data structures.
- You understand that advanced packaging is now part of system architecture, not a downstream implementation step.
- You see advanced packaging as a systems problem across substrate architecture, connectivity, signal and power integrity, thermal behavior, manufacturability, and tool performance.
- You thrive in ambiguous technical problems where strong product judgment matters as much as algorithmic depth.
- You translate customer pain into scalable software architecture.
- You challenge assumptions with clarity, data, and respect.
- You care about engineering craft: performance, maintainability, testability, and extensibility.
Förmåner
- Competitive salaries.
- May be eligible for an annual bonus, equity, and other discretionary bonuses.
- Comprehensive health, wellness, and financial benefits.
- Purchase Synopsys common stock at a 15% discount, with a 24 month look-back.
- Save for your future with retirement plans.
- Maternity and paternity leave, parenting resources, adoption and surrogacy assistance.
- ETO and FTO Programs for time away.
#chip design#verification#manufacturing#EDA#AI/ML#GenAI#Cloud#semiconductors#advanced packaging#3DIC Compiler#substrate design#auto-routing#design rule checking#power delivery network analysis#design for manufacturability#multi-die systems#chiplets#heterogeneous integration
Företag
Synopsys Inc
Publicerade jobb
för 3 veckor sedan
Anställningstyp
Heltid
Arbetsform
På plats
Erfarenhetsnivå
Ledning
Platser
United States
Kvalifikation
Masterexamen, Doktorand
Sökande
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