The Job

Staff Signal Integrity Engineer

Technology, Data & Digital · Software & Web Development · Software Engineering · Embedded Systems

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In short

Qualcomm is seeking a Staff Signal Integrity Engineer in Bangalore, India. This role involves end-to-end SI/PI architecture, analysis, and signoff for next-generation mobile, compute, and automotive platforms. Requires deep expertise in signal and power integrity with over 12 years of experience.

Responsibilities

  • Own end-to-end SI/PI closure for programs (pre-silicon → post-silicon → production)
  • Define design targets and layout design guidelines for all high-speed interfaces
  • Influence architecture decisions early in product lifecycle
  • Ensure SI/PI alignment with product KPIs (performance, yield, power, cost)
  • Drive new IP co-design across IC/IO/PHY, package, and PCB
  • Ensure compliance to standards (JEDEC, PCI-SIG, MIPI, IEEE)
  • Influence PDN architecture definition at system and package level, provide related optimum cost solutions
  • Partner with SoC/PHY design teams, Package engineering, Board/system teams and OEM/ODM ecosystem
  • Lead design reviews and signoff decisions
  • Represent SI/PI in program reviews and leadership forums
  • Define company-wide SI/PI methodologies
  • Drive correlation between pre-silicon models and silicon/lab data
  • Lead debug of eye collapse / jitter margin issues, crosstalk and power noise and silicon-package-board interactions
  • Drive best practices adoption across programs
  • Establish golden methods for system SI/PI
  • Mentor senior engineers across SI/PI domains

Requirements

  • 12+ years in Signal Integrity / Power Integrity / High-speed systems
  • Proven ownership of multiple tapeouts or high-volume products
  • Deep expertise in Transmission line theory, EM fundamentals, SI/PI interactions and jitter/noise coupling
  • Strong hands-on experience with HFSS, ADS, Sigrity, CST, SIwave, HSPICE tools
  • Strong hands-on experience with VNA, TDR, real-time scopes for measurement
  • Experience with high-speed interfaces: LPDDR4/5/6, PCIe Gen4/5/6/7, USB4, UFS, 10G–112G+ PHYs, MIPI CSI/DSI
  • Experience with System PDN

Desired Qualifications

  • Experience with Packaging technologies like FCBGA, 2.5D/3D
  • Experience with Products like Data center, Compute and Servers
  • Track record of Patents, standards contributions, or published work internal / external conferences

Benefits

  • Contribute to next-generation mobile, compute, Automotive and various other connectivity platforms.
  • Opportunity to act as System SI/PI owner across full platform (SoC ↔ package ↔ board ↔ connectors ↔ external systems).
  • Technical owner for high-speed interfaces and system margins.
  • Cross-functional leader driving SIPI driven design convergence.
  • Influence architecture decisions early in product lifecycle.
  • Ensure compliance to standards (JEDEC, PCI-SIG, MIPI, IEEE).
  • Drive new IP co-design.
  • Mentor senior engineers across SI/PI domains.
#signal integrity#power integrity#hardware engineering#high-speed interfaces#system design#PCB design#package engineering#SoC#automotive#mobile#compute#connectivity#JEDEC#PCI-SIG#MIPI#IEEE
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Company

Qualcomm

Job Posted

1 month ago

Employment Type

Full Time

WorkMode

On Site

Experience Level

Senior

Locations

Bangalore, India

Qualification

Bachelor, Master, Doctoral

Applicants

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