Sr Staff Advanced Package Design Engineer - 18918

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In short

Synopsys is looking for a Sr Staff Advanced Package Design Engineer with over 10 years of experience in advanced silicon package design. This role involves collaborating with cross-functional teams, designing and analyzing advanced package solutions, and supporting customer engagements to drive innovation in high-performance silicon chip development.

Responsibilities

Collaborating with cross-functional teams during early design stages to optimize and define SIPI (Signal Integrity/Power Integrity) performance requirements, including bump mapping and power estimation.
Designing and developing advanced silicon package solutions such as silicon interposers, RDL fanout packages, and silicon bridge packages.
Modeling and analyzing advanced package designs to ensure optimal electrical, thermal, and mechanical performance.
Representing Synopsys on business unit projects as a technical leader and subject matter expert in advanced packaging.
Resolving a wide range of design and integration issues using creative, data-driven approaches.
Supporting customer engagements in exploring and implementing advanced package solutions with Synopsys IPs.
Collaborating with global teams to share best practices and drive innovation in advanced packaging methodologies.

Requirements

Bachelor’s degree in Electrical or Electronic Engineering (Master’s or PhD preferred).
Minimum of 10 years’ relevant experience in advanced package design, model extraction, and analysis.
Expert knowledge of advanced circuit and transmission line theory.
Hands-on experience with TSMC, Intel, Samsung, or OSAT advanced package technologies.
Proficiency in multi-physics analysis (EMIR, Thermal, Thermal-Mechanical, Electromagnetic, etc.).
Familiarity with both Windows and Linux operating systems.
Experience with industry-standard EDA tools such as Cadence APD, Innovus, Integrity-3DIC, Synopsys ICC2, 3DIC Compiler, and Fusion Compiler.

Desired Qualifications

A seasoned hardware engineering professional with a passion for advanced silicon package design and a proven track record in delivering innovative solutions for complex semiconductor challenges.
Deep understanding of the latest advancements in 3DIC and multi-physics analysis.
Expertise spans across multiple advanced packaging technologies.
Enthusiastic about pushing the boundaries of what’s possible in high-performance, energy-efficient chip design.
Thrives in a collaborative and fast-paced environment, working seamlessly with multidisciplinary teams and customers.
Strong analytical skills, coupled with the ability to communicate complex technical concepts clearly.
A can-do attitude and demonstrates adaptability, resilience, and a relentless pursuit of excellence.
Excited by the opportunity to make a significant impact at Synopsys, contributing to groundbreaking products that shape the future of technology.

Benefits

Competitive salaries.
Annual bonus, equity, and other discretionary bonuses may be eligible.
Comprehensive health, wellness, and financial benefits.
Medical and healthcare plans.
ETO and FTO Programs for Time Away.
Maternity and paternity leave, parenting resources, adoption and surrogacy assistance.
Employee Stock Purchase Program (ESPP) at a 15% discount with a 24-month look-back.
Retirement Plans (vary by region and country).

Skills

AIMachine LearningGenAICloudSignal IntegrityPower Integrity3DICmulti-physics analysisCadence APDInnovusIntegrity-3DICSynopsys ICC23DIC CompilerFusion Compiler

#advanced package design#silicon interposers#RDL fanout packages#silicon bridge packages#multi-physics analysis#EDA tools#semiconductor

About Synopsys Inc

Smart, Secure Everything—From Silicon to Software Synopsys technology is at the heart of innovations that are changing the way we live and work. The Internet of Things. Autonomous cars. Wearables. Smart medical devices. Secure financial services. Machine learning and computer vision. These breakthroughs are ushering in the era of Smart, Secure Everything―where devices are getting smarter, everything’s connected, and everything must be secure. Powering this new era of technology are advanced silicon chips, which are made even smarter by the remarkable software that drives them. Synopsys is at…

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