RF Module Design Engineer, Senior

Technology, Data & Digital · Software & Web Development · Software Engineering

In short

Qualcomm is seeking a Senior RF Module Design Engineer in Bangalore, India, to design and develop advanced RF passive components for next-generation RFICs. The role involves EM simulation, circuit modeling, and optimization of components for deep sub-micron technologies. A Bachelor's degree in Engineering with 2+ years of relevant experience is required.

Responsibilities

Design and develop RF passive components for next generation highly integrated RF integrated circuits in deep sub-micron 28nm and 14ff CMOS and SOI technologies.
Work with the RF circuit design team to optimize component sizes and performance for use in RF circuit blocks.
Deliver components that include compact models, and DRC clean physical designs.
Execute isolation analysis and optimization to reduce on-chip and chip to package coupling.
Optimization of multichip carriers for RF systems, focusing on loss and isolation.
Participate in RF package, module, and PCB level of design and modeling to optimize overall system level performance.

Requirements

Bachelor's degree in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.
Experience in the design and simulation of RF passive components such as inductors, transformers, MOM capacitors and passive filters.
Experience in design and modeling of RF modules for RF and mmWave frequency.
Demonstrated abilities with EM simulation techniques and tool including MoM EM solvers (EMX, PeakView, Helic) and HFSS.
Experience with circuit design and layout using Cadence tools and Agilent ADS.
Compact RLCK Model extraction of multiport passive components.
Ability to use EM tools to predict circuit level electric and magnetic coupling.
Understanding of Chip fabrication process and design understanding.
Electromagnetic theory, microwave theory and design.
Antenna design and understanding of radiation and propagation wave.
Good understanding of SI and PI at chip, package, and PCB level.
Basic RF system understanding.
Understanding of noise propagation mechanism in chip, package, and PCB.
Tools: Ansys Suit (HFSS, Q3D, SiWave, Layout), Lorentz, Helic, EMX, Cadence virtuoso, Allegro or similar for Package/Module layout, Expedition (or similar) for PCB layout and schematic.
Passionate self-starter and team player with experience in project leadership and multi-tasking.

Desired Qualifications

Master's degree in Science, Engineering, or related field and 1+ year of ASIC design, verification, validation, integration, or related work experience.
PhD in Science, Engineering, or related field.
Exposure to RF package, module, and PCB design and modeling is a plus.
Knowledge of Module and PCB level Power Distribution Network (PDN) and RF transmission line layout and analysis is an asset.
Working experience with programming languages like Python, Matlab, SKILL is also a desired skill.
Working experience and knowledge of Power Amplifier (PA) and Low Noise Amplifier (LNA) matching along with basic understanding of patch antenna design parameters and matching is also desired.

Benefits

Qualcomm is an equal opportunity employer.
Qualcomm is committed to providing an accessible process for individuals with disabilities.
Qualcomm is committed to making our workplace accessible for individuals with disabilities.

Skills

PythonMatlabSKILLPower AmplifierLow Noise Amplifierpatch antennainductorstransformersMOM capacitorspassive filtersEM simulationMoM EM solversHFSSCadenceAgilent ADSRLCK Model extractionAntenna designSignal IntegrityPower IntegrityPDNAnsysLorentzHelicEMXCadence virtuosoAllegroExpedition

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