Principal Thermal Engineer
Construction, Engineering & Trades · Civil & Industrial Engineering · Mechanical Engineering · Electrical Engineering · Chemical Engineering
In short
Qualcomm is seeking a Principal Thermal Engineer to lead thermal architecture solutions for AI computing platforms. This role involves performing CFD simulations, conducting thermal tests, and collaborating with cross-functional teams to optimize performance, efficiency, and reliability from concept to production.
Responsibilities
- Lead thermal architecture solutions through simulation and test while working with various stakeholders.
- Perform thermal simulations utilizing CFD tools from silicon to data center environment throughout product development phase.
- Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations.
- Conduct thermal tests to validate/characterize models and present results to stakeholders.
- Analyze and document simulation and test results.
Requirements
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
- Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
- PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.
Desired Qualifications
- 10+ years of industry experience in electronics cooling, with a strong focus on high-performance computing, AI, or data center products.
- Experience developing thermal solutions for high-power processors, GPUs, AI accelerators, or advanced compute platforms utilizing air, liquid, or hybrid cooling technologies
- Deep understanding of thermal management technologies and design elements, including thermal interface materials (TIMs), heat spreaders, heat sinks, vapor chambers, heat pipes, and forced-air cooling solutions.
- Experience with advanced semiconductor packaging technologies, including 2.5D and 3D package architectures; exposure to high-power AI accelerator packaging is highly desirable.
- Proficiency in scripting and programming for data analysis, model automation, and tool development using languages such as Python, C/C++, MATLAB, or equivalent.
- Strong expertise in computational fluid dynamics (CFD) analysis, with hands-on experience using industry-standard tools such as ANSYS Icepak, Celsius EC, Flotherm, or similar platforms.
- Demonstrated ability to design, execute, and analyze thermal validation experiments in a laboratory environment, including hands-on use of airflow, temperature, power, and data-acquisition instrumentation.
- Experience correlating simulation models with empirical test results and driving model accuracy improvements throughout the product development lifecycle.
- Excellent communication, presentation, and cross-functional collaboration skills, with the ability to influence technical decisions across diverse engineering teams.
- Ability to clearly communicate complex technical concepts, analyses, and recommendations to both technical and non-technical audiences.
- Familiarity with AI/ML workloads, accelerator architectures, and associated thermal challenges is a plus
Benefits
- Competitive annual discretionary bonus program
- Opportunity for annual RSU grants
- Highly competitive benefits package designed to support your success at work, at home, and at play
- Qualcomm is committed to providing an accessible process for individuals with disabilities
- Qualcomm is an equal opportunity employer
#AI#compute#thermal engineering#simulation#validation#optimization#CFD#electronics cooling#high-performance computing#data center
Company
Qualcomm
Job Posted
1 day ago
Employment Type
Full Time
WorkMode
On Site
Experience Level
Senior
Locations
San Diego, United States of America
Qualification
Bachelor, Master, Doctoral
Applicants
Be an early applicant