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Packaging SIPI Engineer, Sr. Staff

Construction, Engineering & Trades · Civil & Industrial Engineering · Electrical Engineering

In short

Qualcomm Technologies, Inc. is seeking a Sr. Staff Packaging SIPI Engineer in San Diego, CA. This role involves signal and power integrity analysis, system simulation, and developing design guidelines to optimize package designs. The position requires collaboration across multiple engineering teams and offers a leadership opportunity, particularly for auto products.

Responsibilities

  • Perform package extraction for time domain and frequency domain analysis.
  • Perform system-level analysis for DDR, SerDes & Mixed signal interfaces.
  • Provide design guidelines for Package design.
  • Perform system simulation and provide feedback for design optimization.
  • Develop design & analysis flow and automate the process.
  • Create technical documentation and presentations.

Requirements

  • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.
  • Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 5+ years of System/Package Design/Technology Engineering or related work experience.
  • PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
  • Experience in AUTO package design and analysis.
  • Experience in SerDes design specifications such as PCIe Gen-x, USB, UFS in Server design.
  • Experience in Matlab to be able to automate existing simulation flow.
  • Experience in programming language (c/c++) or scripting language (Perl/Python) is a plus.
  • Master’s degree or Ph.D with 15+ years of experience.
  • Prior Management experience.
  • 10 years of experience in DDR/SerDes in Package/PCB/System Design related to Compute/Server standards.
  • Experience in Electromagnetics and solid background on transmission line theory & Crosstalk.
  • Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI and Clarity.
  • Experience in simulation tools such as ADS and Hspice.
  • Working knowledge in Cadence Allegro/APD/Sip or Mentor Xpedition.

Desired Qualifications

  • Ability to use AI to enhance team efficiency.

Benefits

  • Competitive annual discretionary bonus program.
  • Opportunity for annual RSU grants.
  • Highly competitive benefits package designed to support your success at work, at home, and at play.

Skills

LPDDRPCIeUFSUSBMIPIDDRSerDesMatlabc/c++PerlPythonHFSSQ3DSentinel-PSIClarityADSHspiceCadence AllegroAPDSipMentor Xpedition
#packaging#signal integrity#power integrity#electrical engineering#system simulation#IP design#PCB design#automation
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About Qualcomm

Enabling a world where everyone and everything can be intelligently connected.

Enabling a world where everyone and everything can be intelligently connected.\n\n

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Company

Qualcomm

Job Posted

5 days ago

Employment Type

Full Time

Work mode

On Site

Salary

US$191,800–287,800 · Negotiable

Experience Level

Senior

Locations

San Diego, United States of America

Qualification

Bachelor, Master, Doctoral

Applicants

Be an early applicant