Mechanical Engineer, Senior Staff
Construction, Engineering & Trades · Civil & Industrial Engineering · Mechanical Engineering
In short
Qualcomm is looking for a Senior Staff Mechanical Engineer in San Diego, California, to lead thermomechanical system solutions for their expanding data center product line. This role involves extensive CFD modeling, liquid cooling design, and collaboration with ODMs/OEMs to deliver world-class, cost-effective systems.
Responsibilities
- Support the design team with system thermal and liquid flow modelling at the package, server, rack and pod level.
- Deliver timely guidance on performance, risk, cost, feasibility, backed by high-quality analysis.
- Lead partner engagements with external partners for solution development and internal analysis.
- Understand thermal power use cases and power envelopes to optimize products.
- Explore new technologies and Intellectual Property to ensure world-class, cost-effective designs.
- Support development partner relationships through sufficient and timely information exchanges.
- Conduct full CFD thermal simulations, deciding when to simulate and ensuring effective modelling approaches.
- Leverage knowledge of practical mechanical engineering best practices, fabrication techniques, tolerance analysis, and failure mechanisms.
Requirements
- A Bachelor’s degree in an approved engineering field — Mechanical, Thermal, HW Engineering (or a closely related engineering discipline).
- 15+ years in thermomechanical design.
- A portfolio of shipped products (high volume products shipped at scale preferred).
- 3+ years experience with liquid cooling of high power density, high efficiency coolers, manifolds, connections.
- Advanced, expert level skill in one or more CFD tools.
- ODM/OEM partnership experience: close working relationships with ODMs and OEMs across the server/rack ecosystem — joint design (JDM), manufacturing readiness, BOM and supply alignment, and executive-level partner management.
Desired Qualifications
- Experience with OCP rack and server architectures, including ORV3 / Open Rack Wide.
- Experience with data center rack-level and system-level thermal design.
- Experience with AI/accelerator or other high-power-density compute platforms.
- Familiarity with server and rack mechanical design, manufacturing methods, tolerance analysis, reliability considerations, and design for high-volume production.
- Experience working directly with ODMs, OEMs, suppliers, and cross-functional engineering teams to develop and validate thermal solutions.
- Familiarity with PCIe, Ethernet, high-speed connectivity, and other technologies relevant to modern server and rack architectures.
- Experience with microfluidic cooling technologies.
Benefits
- Competitive annual discretionary bonus program.
- Opportunity for annual RSU grants.
- Highly competitive benefits package designed to support success at work, at home, and at play.
- Discussion of all that Qualcomm has to offer with your recruiter.
Skills
CFDComputational Fluid Dynamicsthermal simulationthermal modelingANSYS FluentANSYS AEDTANSYS IcepakSTAR-CCM+FloEFDFloTHERMFloTHERM XTSimcenter 3DCOMSOLOpenFOAMconjugate heat transferCHTfluid mechanicsheat transferliquid coolingdirect liquid coolingDLCdirect-to-chip coolingcold platemicrochanneljet impingementmanifoldCDUFWSTCSquick disconnectQDheat exchangerhigh heat fluxhigh power densityserver coolingrack coolingAI acceleratorGPUCPUdata centerOCPORV3Open Rack Widethermomechanical designthermal validationmechanical designDFMtolerance analysisODMOEMJDM
#Mechanical Engineering#Hardware Engineering#Thermal Management#Data Center Systems#Liquid Cooling#CFD Analysis
About Qualcomm
Enabling a world where everyone and everything can be intelligently connected.
Enabling a world where everyone and everything can be intelligently connected.\n\n
Company
QualcommJob Posted
2 days ago
Employment Type
Full Time
Work mode
On Site
Salary
US$169,800–254,600 / year
Experience Level
Senior
Locations
San Diego, United States of America
Qualification
Bachelor
Applicants
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