Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027
Technology, Data & Digital · Software & Web Development · Embedded Systems · Software Engineering
In short
Qualcomm is seeking Hardware Engineering Interns for Summer 2027 to work on CPU, GPU, SoC, Digital Design, and DV projects. This role requires current enrollment in a relevant degree program and availability for 11-14 weeks. Interns will contribute to cutting-edge hardware development, receive mentorship, and participate in professional development activities.
Responsibilities
- Work on one of Qualcomm multi-disciplinary teams: System (architecture, modeling, power, thermal, silicon profiling), Front-end Design (micro-architecture, modeling, RTL), Implementation (synthesis & timing constraints), Design-for-Test (DFT), Physical Design (place & route, CTS, timing closure), Pre-silicon Verification (DV), Emulation, Post-silicon Validation (VI), CAD, and GPU Design.
- Contribute to engineering design and development in MSM SOC and chipset architecture.
- Perform ASIC implementation of image processing camera IP.
- Conduct GPU pipeline validation (stimulus generators, checkers, monitors, drivers, models).
- Analyze and optimize graphics power (Vulkan).
- Validate CPU and SOC-level micro-architecture concepts.
- Develop test and coverage plans, verification methodology, and scalable environments.
- Execute verification plans including regression, debug, and bring-up.
- Develop RTL for modem physical and MAC layer processing.
- Develop verification components using SystemVerilog and UVM.
- Model cellular modem datapaths for bit-exact correctness.
- Work on concepts in computer architecture (CPU, GPU, DSP, interconnects, MMUs, etc.).
- Perform system-level performance modeling and simulation.
- Develop power and thermal management strategies.
- Conduct post-silicon validation and characterization.
- Design embedded software and drivers for Linux/Windows.
Requirements
- Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field
- Must be available for 11–14 weeks during Summer 2027 (May–September)
- Expected graduation date of November 2027 or later
- 1+ years of academic experience with programming languages such as C, C++, Python, Perl, Verilog, SystemVerilog
Desired Qualifications
- Candidates actively pursuing a degree with an anticipated graduation between November 2027 and June 2028
- Currently enrolled in a Master’s or PhD degree program in computer engineering, electrical engineering, or a related field
- Familiarity with multimedia or communication technologies including audio/video codecs, camera, WLAN, LTE, and 5G
- Familiarity with simulators, coverage tools, waveform viewers
- Knowledge of digital design, DSP, wireless communication, LTE, 5G, Wi-Fi
- Exposure to machine learning concepts as applied to digital signal processing or modem architecture is a plus
- Concepts in computer architecture (CPU, GPU, DSP, interconnects, MMUs, etc.)
- Embedded software design, driver development for Linux/Windows
- OS principles and HW/SW interaction
- Experience supporting or optimizing machine learning workloads on embedded systems or accelerators
- Understanding of power/performance tradeoffs and system-level architecture
Benefits
- Competitive hourly pay
- Accrued vacation time
- Relocation coverage
- Furnished housing accommodations for the duration of your internship
- Professional development workshops
- Social events
- Cross-functional speaker sessions
- Executive speaker series
- Competitive annual discretionary bonus program
- Opportunity for annual RSU grants
#CPU#GPU#SoC#Digital Design#DV#Hardware Engineering#Internship#Summer 2027
Company
Qualcomm
Job Posted
3 days ago
Employment Type
Internship
WorkMode
On Site
Experience Level
Entry
Locations
San Diego, United States of America
Qualification
Bachelor, Master, Doctoral
Applicants
Be an early applicant