Thermal Engineer, Staff
Construction, Engineering & Trades · Civil & Industrial Engineering · Mechanical Engineering
In short
Qualcomm is hiring a Staff Thermal Engineer in Hsinchu City, Taiwan, to address complex thermal management challenges for data center AI applications. This role involves creating advanced thermal architecture solutions for high-performance packages, utilizing analytical and empirical skills for both modeling and experimental validation.
Responsibilities
- Perform package and system-level thermal modeling to maximize thermal performance of various packages.
- Design, set up, run, and deliver results for various thermal experiments to validate hardware performance.
- Manage technical projects and collaborate with internal organizations and OEMs/ODMs throughout the development cycle.
- Perform thermal simulations and tests, preparing and presenting results to diverse stakeholders.
Requirements
- 8+ years of industry experience in electronics cooling, preferably related to data center packages and systems.
- Expertise in conducting CFD simulations using tools such as ANSYS-Icepak, Flotherm, or Celsius-EC.
- Hands-on experience enabling test hardware/platforms and executing test vectors for thermal validation and verification.
- Ability to write scripts and perform data analysis; programming experience with Python, C/C++.
- Debugging and bring-up experience, including operating data acquisition equipment.
- Ability to design thermal tests and execute per plan in a laboratory environment.
- Experience with selection of thermal management materials.
- In-depth understanding of forced convection and liquid cooling.
- Thermal design experience with PCBs, enclosures, and heat sinks.
- Some experience with 3D geometry CAD tools such as Solidworks or Creo.
- Excellent presentation, negotiation, and communication skills.
Desired Qualifications
- MSME or PhD in Mechanical Engineering.
- Exposure to cooling systems related to the data center industry is a plus.
Benefits
- Opportunity to create innovative solutions for complex thermal management challenges in data center AI applications.
- Work on the development of advanced thermal architecture solutions for high-performance packages.
#AI#data center#3DIC packages#heat transfer#CFD#ANSYS-Icepak#Flotherm#Celsius-EC#thermal management#thermal test#fans#natural convection#forced convection#radiation#conduction#liquid cooling
Company
Qualcomm
Job Posted
2 weeks ago
Employment Type
Full Time
WorkMode
On Site
Experience Level
Mid-Senior
Locations
Hsinchu City, Taiwan
Qualification
Master, Doctoral, Bachelor
Applicants
Be an early applicant