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Senior SI/PI Engineer (High-Speed Systems)

Technology, Data & Digital · Software & Web Development · Software Engineering · Embedded Systems

In short

Qualcomm is looking for a Senior SI/PI Engineer to support high-speed systems, focusing on components like connectors and optical devices. The role involves performing simulations, evaluating system performance, and collaborating with internal teams and external vendors.

Responsibilities

  • Collaborate with vendors to obtain, optimize, and debug component models, including technical specification negotiations.
  • Perform component- and system-level simulations using validated models.
  • Work with BU and IP teams to define component, channel, and system requirements.
  • Evaluate component performance against system and channel specifications.
  • Support package and PCB design teams with component recommendations and design requirements.
  • Maintain and enhance the component model library.

Requirements

  • Experience in SI/PI, including a strong understanding of electromagnetics and transmission-line theory.
  • Experience with electromagnetic field solvers such as HFSS, Q3D, or Clarity.
  • Experience with circuit and system simulation tools such as ADS and HSPICE.
  • Working knowledge of CAD tools such as Cadence Allegro or Mentor Xpedition.
  • Master's degree in Electrical Engineering, Computer Engineering, or a related field.
  • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
  • Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
  • PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.

Desired Qualifications

  • Experience developing or characterizing high-speed electrical or optical components.
  • Experience with package or PCB design.
  • Experience with interface specifications such as LPDDR, PCIe, or UCIe.
  • Experience with co-packaged copper (CPC) or co-packaged optics (CPO).
  • Experience collaborating with component vendors and cross-functional engineering teams.
  • Industry experience preferred.

Benefits

  • Qualcomm is an equal opportunity employer.
  • Qualcomm is committed to providing an accessible process for individuals with disabilities.
  • Qualcomm is committed to making our workplace accessible for individuals with disabilities.

Skills

SI/PIelectromagneticstransmission-line theoryHFSSQ3DClarityADSHSPICECadence AllegroMentor XpeditionLPDDRPCIeUCIeco-packaged copperco-packaged optics
#SI/PI#High-Speed Systems#Signal Integrity#Power Integrity#components#connectors#repeaters#capacitors#optical devices#simulations#system performance#channel specifications#component specifications#model optimization#model debugging#business unit#IP#package design#PCB design#Qualcomm products#technical specification negotiations#electromagnetics#transmission-line theory#electromagnetic field solvers#circuit simulation#system simulation#CAD tools#high-speed electrical components#high-speed optical components#interface specifications#co-packaged copper#co-packaged optics#cross-functional engineering teams
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About Qualcomm

Enabling a world where everyone and everything can be intelligently connected.

Enabling a world where everyone and everything can be intelligently connected.\n\n

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Company

Qualcomm

Job Posted

1 week ago

Employment Type

Full Time

Work mode

On Site

Experience Level

Senior

Locations

Hsinchu City, Taiwan

Qualification

Master, Bachelor, Doctoral

Applicants

Be an early applicant