The Job

Senior Leader, Electrical & Optical Systems Engineer

Technology, Data & Digital · Software & Web Development · Software Engineering · Embedded Systems

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In short

Qualcomm is looking for a Senior Leader, Electrical & Optical Systems Engineer to define and develop next-generation electrical and optical interconnect technologies for AI, datacenter, networking, and HPC systems. This role requires deep expertise in SerDes, co-design, advanced packaging, and system architecture to drive innovation in interconnect solutions.

Responsibilities

  • Define and drive end-to-end architecture for next-generation interconnect solutions utilizing 112G, 224G, and emerging 448G SerDes technologies, Co-Packaged Optics (CPO), Near-Packaged Optics (NPO), Linear Pluggable Optics (LPO), Co-Packaged Connectors (CPC), Near-Package Connectors (NPC), copper and optical flyover architectures, Active Electrical Cables (AEC), and advanced optical interconnects.
  • Lead system design and performance closure across SerDes and PHY architectures, EIC/PIC integration, optical engines, transceiver subsystems, advanced package substrates, PCB channels, connectors, cables, optics, power delivery, thermal, and mechanical architectures.
  • Own SI/PI methodology and end-to-end link analysis including channel budgeting, COM analysis, jitter, crosstalk, insertion loss, return loss, equalization strategy, and simulation-to-silicon correlation.
  • Drive electrical-optical DSP architecture and algorithm development including TX/RX equalization, CDR, adaptive filtering, FEC, impairment compensation, channel optimization, and overall system performance analysis.
  • Develop system-level models and architecture tradeoff studies spanning bandwidth, reach, power, latency, reliability, manufacturability, cost, and scalability.
  • Provide technical leadership across silicon, package, optics, platform, and software organizations while driving technology roadmaps and productization from concept through deployment.

Requirements

  • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 10+ years of System/Package Design/Technology Engineering or related work experience.
  • Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 9+ years of System/Package Design/Technology Engineering or related work experience.
  • PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ year of System/Package Design/Technology Engineering or related work experience.
  • Demonstrated success productizing 112G and/or 224G PAM4 electrical and optical communication systems.
  • Deep expertise in High-speed SerDes architectures.
  • Deep expertise in Electrical-optical DSP algorithms.
  • Deep expertise in PAM4 communication systems.
  • Deep expertise in Signal Integrity (SI) and Power Integrity (PI).
  • Deep expertise in EIC/PIC co-design and heterogeneous integration.
  • Deep expertise in Optical transceivers and optical engines.
  • Deep expertise in Co-packaged and near-packaged optics.
  • Deep expertise in Advanced packaging, PCB, connector, cable, CPC, NPC, and flyover technologies.
  • Deep expertise in End-to-end system modeling and architecture.
  • Deep expertise in AI networking, scale-up, and scale-out infrastructures.
  • Hands-on experience with ADS, HFSS, CST, HSPICE, MATLAB, Python, Cadence Sigrity, Lumerical, Zemax, Verilog-A, SystemVerilog, COM analysis tools, IBIS-AMI modeling.

Desired Qualifications

  • MS or PhD in Electrical Engineering, Optical Engineering, Physics, or a related discipline.
  • 15+ years of experience developing high-speed communication, networking, or optical interconnect products.
  • Experience developing and productizing 224G+ electrical and optical interconnect solutions.
  • Experience with CPO, NPO, CPC, NPC, flyover copper, flyover optical, silicon photonics, and EIC/PIC integration.
  • Familiarity with Ethernet, PCIe, UALink, NVLink, OIF CEI, IEEE 802.3, and emerging AI interconnect standards.
  • Experience with chiplets, UCIe, silicon photonics, 2.5D/3D integration, and advanced packaging technologies.
  • Track record influencing industry standards, technology roadmaps, and large cross-functional architecture decisions.
  • Proven success leading and mentoring senior technical teams across multiple engineering disciplines.

Benefits

  • Competitive annual discretionary bonus program.
  • Opportunity for annual RSU grants.
  • Highly competitive benefits package designed to support your success at work, at home, and at play.
  • Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
#AI#datacenter#networking#HPC#electrical systems#optical systems#SerDes#co-design#packaging#system architecture#flyover architectures#co-packaged optics#silicon photonics#interconnects
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Company

Qualcomm

Job Posted

2 weeks ago

Employment Type

Full Time

WorkMode

On Site

Experience Level

Senior

Locations

San Diego, United States of America

Qualification

Bachelor, Master, Doctoral

Applicants

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