Leading Dry etch process development

• Develop/innovate dry etch processes to meet structural and electrical specifications.
• Work and innovate with process integration teams to influence integration flow or specs.
• Collaborate and lead cross-functional teams to solve complex structural problems.
• Support root cause and unique defect analysis.
• May require travel for project-related purposes.
• Present process and technology roadmaps for current and future technology nodes.

Interaction with other Process Areas

• Identify and drive towards a collaborative solution. Guide other area's technology roadmaps.
• Lead or be a part of cross-functional task force groups driving towards a target.
• Develop expertise in other areas process hardware, or technologies.

Interaction with Dry Etch peers

• Be a resource and mentor for peers in dry etch technology and/or project management.
• Provide critical updates to upper management on project status and impacts.

Successful candidates for this position will have:

• An aptitude for a research and development environment.
• Experience in NVM parts integration/module ownership
• Experience with both ICP and CCP tools
• Experience in 3D NAND Worldline access or contact module.
• High aspect ratio etch experience (preferred)
• Experience in managing technical projects or leading groups of other engineers.
• Experience in or understanding of statistical process control and analysis.
• Understanding of various types of dry etch reactors (e.g., RF sources, chemistries)
• Knowledge of plasma physics, transport or surface phenomena gained through experience or coursework. 
• Demonstrated leadership in problem-solving.
• Strong computer skills, including MS Office.

Education

• MS / PhD with 3-10 years of relevant experience
• BS + 5-10 years of relevant experience