The Job

Packaging Engineer

Construction, Engineering & Trades · Civil & Industrial Engineering · Mechanical Engineering

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In short

Microsoft's Quantum Systems organization is seeking a Packaging Engineer with a focus on mechanical simulation to advance cutting-edge quantum technologies. This role involves developing and maintaining simulations for quantum packaging hardware, assessing reliability, and establishing robust assembly processes with a globally distributed team. The position requires a Master's degree in a relevant engineering field or equivalent experience, with preferred qualifications including a Doctorate and proficiency in FEA tools.

Responsibilities

  • Perform thermal, structural, and thermo-mechanical simulations for quantum packaging hardware.
  • Develop simulations using hand calculations, reduced-order models, and finite-element analysis (FEA).
  • Assess packaging reliability, including risks associated with flip-chip attach, solder joints, and PCB interfaces.
  • Generate and maintain reusable simulation templates, material libraries, and modeling workflows.
  • Work in teams or independently as required.
  • Embody Microsoft's Culture and Values.

Requirements

  • Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 2+ years technical engineering experience OR equivalent experience.
  • Ability to meet Microsoft, customer and/or government security screening requirements.
  • Ability to leverage AI tools to drive innovation and efficiency.
  • Evaluate agentic solutions with measurable metrics and human in the loop safeguards following Microsoft Responsible AI requirements for generative AI.

Desired Qualifications

  • Doctorate in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field OR Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years technical engineering experience OR equivalent experience.
  • Experience with cryogenic or extreme-environment hardware (cryogenic, vacuum, low-vibration, or high-precision systems).
  • Proficiency with FEA tools such as ANSYS, COMSOL, Abacus, or equivalent, including model setup, meshing strategies, and convergence assessment.
  • Familiarity with advanced packaging technologies (flip chip, substrates, interposers, solder joints, PCB attach).
  • Experience correlating simulation with cryogenic test data and iterating models based on measurement feedback.
  • Strong fundamentals in heat transfer, solid mechanics, and numerical methods.
  • Demonstrated ability to translate ambiguous design questions into well-scoped simulation problems and actionable outputs.

Benefits

  • Certain roles may be eligible for benefits and other compensation.
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Company

Microsoft

Job Posted

3 weeks ago

Employment Type

Full Time

WorkMode

Hybrid

Experience Level

Mid-Senior

Locations

United States

Qualification

Master, Bachelor, Doctoral

Applicants

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