Packaging Engineer
Manufacturing & Production · Production & Assembly · Manufacturing Engineering
In short
Microsoft is seeking a Packaging Engineer to develop and adapt packaging processes and materials for unique quantum devices. This role involves hands-on assembly, process optimization, failure analysis, and collaboration with a global team to scale complex quantum hardware.
Responsibilities
- End-to-end quantum device package assembly and build execution.
- Manufacturing equipment operation, training, and process optimization.
- Packaging configuration documentation and records maintenance.
- Analysis and problem-solving involving assembly process failures.
- Reliability testing, adhesive characterization, and process development.
- Develop and maintain robust assembly processes for quantum devices.
- Support general laboratory organization and upkeep.
- Work in teams or independently as required.
- Embody our Culture and Values.
Requirements
- Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field OR equivalent experience.
- Ability to meet Microsoft, customer and/or government security screening requirements.
- Microsoft Cloud Background Check required.
- Citizenship and Citizenship Verification required due to export control regulations.
- Ability to leverage AI tools to drive innovation and efficiency.
- Evaluate agentic solutions with measurable metrics and human in the loop safeguards following Microsoft Responsible AI requirements for generative AI.
Desired Qualifications
- Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 2+ years technical engineering experience OR equivalent experience.
- Hands-on experience with industry standard packaging and assembly processes (wire bonding, die bonding, adhesive dispense).
- Hands-on experience with industry standard packaging and assembly materials (PCBs, adhesives, solder).
- Ability to work in a team and effectively communicate to meet deadlines and deliver results.
- 2+ years of hands-on experience with packaging of complex (optomechanical, MEMS, microwave) devices.
Benefits
- Potential eligibility for benefits and other compensation.
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