Executive Director of R&D Engineering for 3DIC-Advance Packaging
Technology, Data & Digital · Software & Web Development · Software Engineering · Embedded Systems
In short
Synopsys seeks an experienced Executive Director of R&D Engineering to lead global teams in 3DIC and advanced packaging solutions for AI and HPC products. The role requires deep semiconductor expertise, strategic roadmap development, and strong customer engagement to drive innovation in chiplet architectures and heterogeneous integration.
Responsibilities
- Lead the global engineering organization responsible for 3DIC silicon IP and advanced packaging design, covering layout, physical design, signal integrity, power integrity, thermal modeling, and mechanical stress analysis for AI infrastructure and HPC products.
- Own the technical roadmap and execution strategy for chiplet architectures, heterogeneous integration, and die-to-die interconnect solutions that align with Synopsys business objectives and customer requirements.
- Drive cross-functional collaboration with EDA tool development teams, product management, go-to-market, and customer success to ensure Synopsys 3DIC solutions are differentiated, adoptable, and production ready.
- Engage directly with leading semiconductor customers and ecosystem partners to shape technical requirements, validate architectures, and accelerate adoption of Synopsys 3DIC and advanced packaging IP.
- Build, scale, and mentor a high-performing, multi-site engineering team, establishing a culture of accountability, technical excellence, and continuous improvement.
- Track and synthesize industry trends in 3DIC, chiplets, and advanced packaging, translating emerging technologies and competitive dynamics into actionable product and technology decisions.
- Make sound engineering tradeoffs across performance, power, area, cost, yield, and manufacturability, ensuring solutions meet both technical and business success criteria.
Requirements
- Bachelor's or Master's degree in Electrical Engineering or a related technical discipline, or equivalent professional experience with demonstrated technical leadership in semiconductor design.
- 15+ years of hands-on experience in the semiconductor industry with deep expertise in advanced packaging, 3DIC technologies, chiplet architectures, and heterogeneous integration.
- Proven track record building and leading large, geographically distributed engineering organizations that have delivered complex 3DIC or advanced packaging solutions from architecture through production.
- Deep technical command of 3DIC-specific design and signoff challenges including signal integrity, power integrity, thermal management, mechanical stress, reliability physics, and yield optimization.
- Demonstrated ability to define and execute multi-year technology roadmaps for silicon IP or advanced packaging, balancing technical vision with business strategy and market requirements.
- Strong customer-facing leadership experience, including direct engagement with semiconductor customers, foundries, and ecosystem partners to define requirements, validate solutions, and drive adoption.
- Experience working effectively in highly matrixed, global organizations, influencing across EDA development, product management, go-to-market, manufacturing, and customer success teams without direct reporting authority.
Desired Qualifications
- Ability to identify core issues in complex 3DIC signoff problems and outline paths forward balancing technical correctness with schedule reality.
- Ability to build teams that value clarity, obstacle removal, and challenging problem-solving.
- Ability to engage with VPs of Engineering at top semiconductor companies, understand challenges, and translate them into technical requirements.
- Comfortable making tradeoff decisions with incomplete information and explaining the reasoning.
- Ability to recognize and course-correct when a technical plan drifts from a business objective.
- Investment in the growth of engineers, identifying readiness for the next level and creating opportunities.
Benefits
- Annual bonus, equity, and other discretionary bonuses.
- Comprehensive health, wellness, and financial benefits.
- Competitive total rewards package.
- Comprehensive medical and healthcare plans.
- ETO and FTO Programs.
- Maternity and paternity leave, parenting resources, adoption and surrogacy assistance.
- Purchase Synopsys common stock at a 15% discount, with a 24-month look-back.
- Retirement plans that vary by region and country.
#3DIC#Advance Packaging#AI#HPC#Chiplet Architecture#Heterogeneous Integration
Company
Synopsys Inc
Job Posted
2 weeks ago
Employment Type
Full Time
WorkMode
On Site
Experience Level
Executive
Locations
Sunnyvale, United States
Applicants
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