Staff Engineer, Thermal
Construction, Engineering & Trades · Civil & Industrial Engineering · Mechanical Engineering
In short
Qualcomm is looking for a Staff Engineer, Thermal to lead thermal architecture solutions for AI computing platforms, including simulation, validation, and optimization. The role involves working cross-functionally to solve complex thermal challenges from concept through production.
Responsibilities
- Lead thermal architecture solutions through simulation and test while working with various stakeholders.
- Perform thermal simulations utilizing CFD tools from silicon to data center environment throughout product development phase.
- Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations.
- Conduct thermal tests to validate/characterize models and present results to stakeholders.
- Analyze and document simulation and test results.
Requirements
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
- OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
- OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.
- 6+ years of industry experience in electronics cooling, with a strong focus on high-performance computing, AI, or data center products.
- Experience developing thermal solutions for high-power processors, GPUs, AI accelerators, or advanced compute platforms utilizing air, liquid, or hybrid cooling technologies.
- Deep understanding of thermal management technologies and design elements, including thermal interface materials (TIMs), heat spreaders, heat sinks, vapor chambers, heat pipes, and forced-air cooling solutions.
- Experience with advanced semiconductor packaging technologies, including 2.5D and 3D package architectures; exposure to high-power AI accelerator packaging is highly desirable.
- Proficiency in scripting and programming for data analysis, model automation, and tool development using languages such as Python, C/C++, MATLAB, or equivalent.
- Strong expertise in computational fluid dynamics (CFD) analysis, with hands-on experience using industry-standard tools such as ANSYS Icepak, Celsius EC, Flotherm, or similar platforms.
- Demonstrated ability to design, execute, and analyze thermal validation experiments in a laboratory environment, including hands-on use of airflow, temperature, power, and data-acquisition instrumentation.
- Experience correlating simulation models with empirical test results and driving model accuracy improvements throughout the product development lifecycle.
- Excellent communication, presentation, and cross-functional collaboration skills, with the ability to influence technical decisions across diverse engineering teams.
- Ability to clearly communicate complex technical concepts, analyses, and recommendations to both technical and non-technical audiences.
Desired Qualifications
- Familiarity with AI/ML workloads, accelerator architectures, and associated thermal challenges is a plus
Benefits
- Competitive annual discretionary bonus program
- Opportunity for annual RSU grants
- Highly competitive benefits package designed to support your success at work, at home, and at play
Skills
ANSYSPythonC++MATLABCFDFlothermIcepakCelsius EC
#Thermal Engineering#Packaging Engineering#AI Computing#Hardware Systems#CFD Simulation#Product Development
Enabling a world where everyone and everything can be intelligently connected.\n\n
Company
QualcommJob Posted
2 weeks ago
Employment Type
Full Time
Work mode
On Site
Salary
US$160,200–240,200 · Negotiable
Experience Level
Mid-Senior
Locations
San Diego, United States of America
Qualification
Bachelor, Master, Doctoral
Applicants
Be an early applicant
Similar Jobs
Synopsys Inc
Ho Chi Minh City, VietnamApplications Engineering Engineer - 19307
Full Time Be an early applicant Posted 4 days ago
Synopsys Inc
Ho Chi Minh City, VietnamApplications Engineering Engineer - 19308
Full Time Be an early applicant Posted 4 days ago
Synopsys Inc
Ho Chi Minh City, VietnamApplications Engineering Engineer - 19309
Full Time Be an early applicant Posted 4 days ago
HCLTech
Chennai, IndiaSenior Technical Specialist
Full Time Be an early applicant Posted 4 days ago
HCLTech
Chennai, IndiaLead Administrator (Support & Operations)
Full Time Be an early applicant Posted 4 days ago
Ericsson
Noida, IndiaSenior Technical Authority Expert
Full Time Be an early applicant Posted 4 days ago
