Senior Group Technical Architect

Technology, Data & Digital · Software & Web Development · Software Engineering · Embedded Systems

In short

HCLTech seeks a Senior Group Technical Architect to lead end-to-end SoC/ASIC chip programs from architecture to silicon bring-up. The role involves customer engagement, technical leadership, and managing cross-functional teams in RTL design, verification, and physical design.

Responsibilities

Own end-to-end chip program delivery for customer engagements (architecture to silicon bring-up).
Act as primary technical interface to customers, driving trust, reviews, and escalations.
Lead cross-functional teams across RTL Design, Verification (UVM-based), Physical Design (PnR, STA, Signoff), and DFT and integration.
Drive program planning, estimation, and execution in a services environment.
Ensure adherence to schedule, quality, and PPA (Power, Performance, Area) targets.
Manage risk, dependencies, and change requests in dynamic customer programs.
Support pre-sales and solutioning, including effort estimation, proposal reviews, and technical win support.
Enable scaling of teams (onsite-offshore model) and optimize utilization.
Lead tapeout readiness reviews and post-silicon debug coordination.
Drive account growth by identifying new opportunities within existing customers.
Balance delivery excellence with margin awareness.
Mentor next-level leaders (Module Leads, Project Leads).
Bring execution rigor with a customer-centric mindset.
Communicate effectively for CXO-level interactions.

Requirements

12-16 years in VLSI / SoC development.
Proven experience leading customer-facing chip programs.
Strong knowledge of SoC architecture and integration.
Strong knowledge of RTL to GDSII full flow.
Strong knowledge of Verification methodologies (UVM).
Strong knowledge of Physical design and signoff.
Experience in multiple successful tapeouts.
Strong stakeholder management (customer + internal).
Ability to lead distributed/global teams (onsite–offshore).

Desired Qualifications

Experience working in semiconductor services companies (e.g., large SI/ES firms).
Exposure to advanced nodes (≤7nm).
Experience with IPs (CPU subsystems, high-speed interfaces, AI/ML accelerators).
Familiarity with foundry interactions and tapeout processes.

Benefits

Supercharge your potential.
Find your career.
Find your spark.
A place that knows that helping its customers stay on top starts by putting its people first.

Skills

SoC architectureRTLGDSIIUVMPhysical designSTASignoffDFTASICVLSIIP integrationAI/ML accelerators

#VLSI#SoC#ASIC#Chip Lead#Technical Architect#Architecture#Silicon#RTL Design#Verification#Physical Design#DFT#Tapeout#Debug#Pre-sales#Estimation#Proposal#Semiconductor#IP#Foundry#Leadership#Customer Engagement

About HCLTech

Supercharging progress through technology and innovation

HCLTech is a global technology company, home to 219,000+ people across 54 countries, delivering industry-leading capabilities centered around digital, engineering and cloud, powered by a broad portfolio of technology services and products. We work with clients across all major verticals, providing industry solutions for Financial Services, Manufacturing, Life Sciences and Healthcare, Technology and Services, Telecom and Media, Retail and CPG, and Public Services. Consolidated revenues as of 12 months ending September 2022 totaled $12.1 billion. To learn how we can supercharge progress for…

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