Package Manufacturing Engineer, Senior to Staff Level (Kaohsiung or Taichung)
Manufacturing & Production · Production & Assembly · Manufacturing Engineering · Packaging
In short
Qualcomm is seeking a Senior to Staff Level Package Manufacturing Engineer to support product development and advanced technologies in semiconductor packaging. The role involves cross-functional collaboration and requires deep understanding of packaging requirements, manufacturing processes, and quality concepts.
Responsibilities
- Support development of products and advanced technologies for Qualcomm bumping, WLP, Flip Chip CSP & BGA, SiP module, EMIB, CoWoS, CPO, Data center, ASIC, SIP, Server, Rack, and 2.5/3D Chiplet applications.
- Support product material and design selections, technical risk assessments, mitigation plans, and development from concept to production.
- Develop a strong understanding of substrate and assembly process details, SPC, Control plans, OCAPs, FMEAs, PCN, CARs.
- Work cross-functionally with Design, Device process development, internal and subcontract Packaging groups.
Requirements
- 10+ years of relevant work experience in Semiconductor (Packaging) Engineering or Manufacturing.
- Deep understanding of packaging requirements, process capability and equipment capability throughout the industry and the ability to incorporate best engineering practices for all backend assembly process included automotive products requirements.
- Familiar with excel, JMP data analysis tool.
- Basic knowledge of excel VBA, Tableau software.
- Good understanding of Chip level and package level reliability and failure analysis methodology.
- Understand yield management, continuous improvement, assembly cycle time analysis and cost reduction.
- Fluent in English and Mandarin, both spoken and written.
- Proactive working attitude and capable to handle new challenge.
Desired Qualifications
- Good knowledge of quality concept and RMA process.
- Basic knowledge of foundry process.
- Good understanding of wafer bumping, laser grooving, wafer saw, Pick and place, underfill and Heat spread processes.
- Good experience with yield management software (O+), JMP analysis tool.
- Understand assembly and test house working model, turnkey model, supply chain and KPI.
Benefits
- Qualcomm is an equal opportunity employer.
#semiconductor#packaging#manufacturing#engineering#hardware
Company
Qualcomm
Job Posted
1 week ago
Employment Type
Full Time
WorkMode
On Site
Experience Level
Senior
Locations
Kaohsiung, Taiwan
Taichung, Taiwan
Qualification
Bachelor, Master
Applicants
Be an early applicant