FY27 Intern - CPU Engineering Internship 2027 - 6 months, Cork
Technology, Data & Digital · Software & Web Development · Embedded Systems · Software Engineering
In short
The Snapdragon Engineering team in Cork, Ireland is looking for interns for their CPU teams to work on Advanced gen CPU Micro Architecture RTL Design, CPU Design verifications, and Post-Silicon CPU cores Power and Performance. This role offers hands-on experience with cutting-edge IP for Snapdragon chipsets and advanced CMOS processes.
Responsibilities
- Work on Advanced gen CPU Micro Architecture RTL Design.
- Engage in CPU Design verification.
- Focus on Post-Silicon CPU cores Power and Performance.
- Experience development of leading-edge ASICs and SoCs in advanced CMOS processes for multi-function mobile platforms.
- Develop a wide array of skills relevant to a future career in the industry.
Requirements
- Strong Interpersonal, communications and teamwork skills required.
- Strong Computer Architecture, Digital Design, Coding and Scripting: Verilog, C/C++, Python, Tcl/Perl/shell-scripting.
- Verification Methodology using System Verilog.
- Knowledge of Low Power Design.
- Knowledge of ARM processors or RISC-V processors architecture, Power, Performance and Industry Benchmarks.
- Excellent computer skills (Including, but not limited to: Windows, Office, Visio).
- Dedication to successful and thorough completion of assigned tasks.
- Must have completed your second year of a Bachelor’s degree and ideally be in your second year of a Master's Degree.
Desired Qualifications
- Enrolled in a bachelor or master’s degree in Electrical Engineering or Computer Engineering.
- Coursework in the following areas: Computer Architecture, Embedded Systems, Software Programming, RTL Design and Verification, Low Power VLSI, Circuits and Electronics, Signals and systems, Digital Integrated Circuits, Digital Signal Processing.
Benefits
- Internships will commence from as early as January 2027.
- Opportunity to work with the latest toolsets and flows on bleeding edge FinFET/GAA silicon nodes in 3nm and below.
- Work directly with architecture, software, measurement and SoC teams in Ireland and other global Qualcomm locations.
Skills
VerilogC++PythonTclPerlshell scriptingSystem VerilogARM processorsRISC-V processorsLow Power DesignComputer ArchitectureDigital DesignEmbedded SystemsVLSISignals and systemsDigital Integrated CircuitsDigital Signal Processing
#Internship#CPU Engineering#Micro Architecture#RTL Design#Verification#Post-Silicon#Power#Performance#Qualcomm#Cork
Enabling a world where everyone and everything can be intelligently connected.\n\n
Company
QualcommJob Posted
2 days ago
Employment Type
Internship
Work mode
On Site
Experience Level
Entry
Locations
Cork, Ireland
Qualification
Bachelor, Master, Undergraduate
Applicants
Be an early applicant
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