The Job

Staff Signal Integrity Engineer

Technology, Data & Digital · Software & Web Development · Software Engineering · Embedded Systems

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In short

Staff Signal Integrity Engineer needed in Bangalore, India for Qualcomm's CHS Signal Integrity organization. Responsible for end-to-end SI/PI architecture, analysis, and signoff for next-generation mobile, compute, and connectivity platforms. Requires deep expertise in high-speed interfaces and 12+ years of relevant experience.

Responsibilities

  • Own end-to-end SI/PI closure for programs (pre-silicon → post-silicon → production).
  • Define design targets and layout design guidelines for all high-speed interfaces.
  • Influence architecture decisions early in product lifecycle.
  • Ensure SI/PI alignment with product KPIs (performance, yield, power, cost).
  • Drive new IP co-design across IC/IO/PHY, package, and PCB.
  • Ensure compliance to standards (JEDEC, PCI-SIG, MIPI, IEEE).
  • Influence PDN architecture definition at system and package level.
  • Partner with SoC/PHY design teams, Package engineering, Board/system teams and OEM/ODM ecosystem.
  • Lead design reviews and signoff decisions.
  • Represent SI/PI in program reviews and leadership forums.
  • Define company-wide SI/PI methodologies.
  • Drive correlation between pre-silicon models and silicon/lab data.
  • Lead debug of eye collapse / jitter margin issues, crosstalk and power noise and silicon-package-board interactions.
  • Drive best practices adoption across programs.
  • Establish golden methods for system SI/PI.
  • Mentor senior engineers across SI/PI domains.

Requirements

  • 12+ years in Signal Integrity / Power Integrity / High-speed systems.
  • Proven ownership of multiple tapeouts or high-volume products.
  • Deep expertise in Transmission line theory, EM fundamentals, SI/PI interactions and jitter/noise coupling.
  • Strong hands-on experience with HFSS, ADS, Sigrity, CST, SIwave, HSPICE tools.
  • Strong hands-on experience with VNA, TDR, real-time scopes for measurement.
  • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
  • OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
  • OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.

Desired Qualifications

  • Experience with Packaging technologies like FCBGA, 2.5D/3D.
  • Experience with Products like Data center, Compute and Servers.
  • Track record of Patents, standards contributions, or published work internal / external conferences.

Benefits

  • Qualcomm is an equal opportunity employer.
  • Qualcomm is committed to providing an accessible process for individuals with disabilities.
  • Qualcomm is committed to making our workplace accessible for individuals with disabilities.
#Signal Integrity#Power Integrity#Hardware Engineering#Electrical Engineering#SoC#Package Engineering#PCB Design#High-Speed Interfaces#JEDEC#PCI-SIG#MIPI#IEEE#PDN
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Company

Qualcomm

Job Posted

2 weeks ago

Employment Type

Full Time

WorkMode

On Site

Experience Level

Senior

Locations

Bangalore, India

Qualification

Bachelor, Master, Doctoral

Applicants

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