Senior Engineer - IC Package Design
Construction, Engineering & Trades · Civil & Industrial Engineering · Mechanical Engineering
In short
We are looking for a Senior Engineer - IC Package Design in Bangalore, India to manage and execute complex semiconductor product development programs. This role focuses on program execution, cross-functional coordination, and ensuring timely delivery from planning through tapeout and manufacturing readiness, utilizing project management tools and driving issue resolution.
Responsibilities
- Support execution of IC package design programs from early design planning through tapeout and post-tapeout support.
- Develop and maintain execution plans, schedules, task lists, and milestone trackers.
- Track risks, issues, dependencies, and action items across package design, verification, and manufacturing activities.
- Drive action item follow-up, escalation, and closure with clear ownership and timelines.
- Prepare and deliver status updates, execution summaries, dashboards, and readiness reports for project and engineering stakeholders.
- Coordinate across Package Design, Package Integration, SI/PI, and Operations teams to ensure execution alignment.
- Work closely with Package Process teams to align design assumptions with manufacturing capabilities, process constraints, and yield considerations.
- Partner with Substrate Engineering & Technology teams to track substrate development, availability, risks, and schedule alignment.
- Engage with OSATs and Suppliers to support execution readiness, resolve blocking issues, and ensure manufacturability alignment.
- Draft, document, and maintain process flows that clearly define execution steps, handoffs, inputs, and outputs across the package design lifecycle.
- Develop clear, structured documentation describing package design and execution workflows, design release and handoff steps, readiness checks and acceptance criteria, and common issues, failure modes, and escalation paths.
- Translate complex technical activities into repeatable, well-defined process steps.
- Capture lessons learned and best practices and incorporate them into updated process documentation and workflows.
Requirements
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
- OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
- OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
- Experience supporting complex, cross-functional engineering programs.
- Strong organizational skills with the ability to manage multiple workstreams in parallel.
- Experience using project / program management tools, including execution dashboards, milestone and dependency trackers, Gantt charts or schedule views, and action-item and risk tracking tools.
- Comfortable driving execution in matrixed organizations without direct reporting authority.
- Strong written and verbal communication skills.
- Familiarity with IC package development lifecycles and execution flows.
- Working knowledge of IC package design, layout, integration, or manufacturing concepts.
- Exposure to package design or EDA tools such as Cadence APD / SIP, Cadence Innovus / Virtuoso, Mentor Xpedition, Valor and RAVEL.
Desired Qualifications
- Scripting or automation experience (e.g., Python, TCL) is a plus but not required.
Benefits
- Qualcomm is an equal opportunity employer.
- Qualcomm is committed to providing an accessible process for individuals with disabilities.
- Qualcomm is committed to making our workplace accessible for individuals with disabilities.
#IC package design#semiconductor#program execution#cross-functional coordination#tapeout#manufacturing readiness#design planning#feasibility#EDA tools#automation#issue tracking#dependency management#risk reduction#project management#schedules#milestones#status updates#dashboards#design reviews#package integration#SI/PI#operations#package process#NPI#substrate engineering#OSATs#suppliers#design flows#documentation#process flows#scripting#lessons learned#best practices#Cadence APD#Cadence SIP#Cadence Innovus#Cadence Virtuoso#Mentor Xpedition#Valor#RAVEL#Python#TCL
Company
Qualcomm
Job Posted
1 month ago
Employment Type
Full Time
WorkMode
On Site
Experience Level
Senior
Locations
Bangalore, India
Qualification
Bachelor, Master, Doctoral
Applicants
Be an early applicant