Principal EDA R&D Engineer, Advanced Packaging
Technology, Data & Digital · Software & Web Development · Software Engineering · Embedded Systems · Software Architecture
In short
Synopsys is looking for a Principal EDA R&D Engineer with expertise in package substrate design and EDA tool development to lead R&D projects. This role involves developing advanced EDA software using C++, Python, and TCL, and collaborating with industry partners to advance semiconductor packaging technologies.
Responsibilities
- Lead R&D projects for package substrate design automation, including auto-routing, DRC verification, power delivery network analysis, and design-for-manufacturing.
- Drive technical direction for database models to support schematic-driven layout and integration across the Synopsys packaging tool suite.
- Develop and optimize EDA software using C++, Python, and TCL, addressing challenges in computational geometry, constraint solving, and physical design automation.
- Collaborate with foundries and assembly/test companies on emerging substrate technologies, translating Design Rule Manuals and manufacturing requirements into tooling.
- Work with cross-functional teams to define input/output formats, integrate analysis capabilities, and ensure database architectures support complex designs.
- Provide technical guidance to R&D engineers, reviewing designs and implementations, and helping the team navigate technical tradeoffs.
- Engage with customers in senior-level technical discussions, representing Synopsys expertise and contributing to product direction.
Requirements
- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience in EDA or semiconductor design.
- 10+ years of experience in EDA software development focusing on physical design automation, package design, or substrate design.
- Deep technical expertise in package substrate physical design methodologies (schematic-driven layout, auto-routing, DRC, PDN analysis).
- Strong programming proficiency in Python or TCL for tool integration and automation.
- Demonstrated track record leading R&D projects that resulted in production software or significant architectural improvements.
- Experience collaborating with foundries, OSATs, or substrate manufacturers on Design Rule Manuals, technology files, and output formats like ODB++.
- Solid foundation in computational geometry and algorithm design for layout automation; experience with constraint-based routing or placement is highly valued.
Desired Qualifications
- Ability to engage in technical discussions with senior engineering leaders and clearly articulate complex tradeoffs and solutions.
- Ability to raise concerns about technical requirements conflicting with architectural principles and propose alternative approaches.
- Ability to write well-structured code with attention to maintainability, documentation, and long-term supportability.
- Effectiveness in environments with evolving requirements, especially for new packaging technologies with not-yet-finalized design rules.
- Ability to guide less experienced engineers through technical challenges, building their capabilities and judgment.
- Ability to approach partnerships with foundries and OSATs as collaborative technical relationships, understanding their constraints and processes.
Benefits
- Competitive salaries.
- Annual bonus, equity, and other discretionary bonuses may be eligible.
- Comprehensive health, wellness, and financial benefits.
- Purchase Synopsys common stock at a 15% discount, with a 24-month look-back.
- Retirement plans that vary by region and country.
- Maternity and paternity leave, parenting resources, adoption and surrogacy assistance.
- In addition to company holidays, ETO and FTO Programs are available.
- Comprehensive medical and healthcare plans.
#EDA#R&D#Advanced Packaging#Engineering#Software Development