Flip Chip Bonding Process Engineer
Manufacturing & Production · Production & Assembly · Manufacturing Engineering · Process Improvement
In short
Qualcomm is looking for a Flip Chip Bonding Process Engineer in Singapore to provide engineering support for backend semiconductor packaging processes. This role involves supporting daily production, troubleshooting, and driving continuous improvement in yield, quality, and efficiency. The ideal candidate will have a Bachelor's degree in Engineering and 2 years of relevant experience, or be a strong fresh graduate.
Responsibilities
- Provide engineering support for backend semiconductor packaging processes, including flip chip bonding, reflow soldering, and plasma cleaning.
- Support daily production activities to achieve output, quality, efficiency, productivity, yield, cycle time, and safety targets.
- Monitor and analyze process data to identify trends, risks, and improvement opportunities.
- Lead troubleshooting and problem-solving for process abnormalities, yield loss, quality excursions, and production issues.
- Drive permanent corrective and preventive actions for chronic process and quality issues.
- Evaluate new products, materials, and processes during pilot runs and ensure process readiness for production release.
- Work with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution.
- Maintain Work Instructions, Control Plans, FMEA, and Process Control documents.
- Prepare production lines and process documentation for audits.
- Support audit follow-up actions and ensure timely closure of findings.
- Promote compliance with safety, quality, and manufacturing standards.
- Identify and implement improvement actions to enhance process stability, productivity, yield, and cost effectiveness.
- Apply statistical and quality tools such as SPC, MSA, and structured problem-solving methods.
- Participate in cross-functional initiatives to improve manufacturing robustness and operational excellence.
Requirements
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
- Bachelor’s Degree in Engineering, preferably in Mechanical, Materials, Chemical, Manufacturing, or a related discipline.
- Strong data analysis, problem-solving, and critical thinking skills.
- Good communication and collaboration skills, with the ability to work effectively with cross-functional teams.
- Good planning, organization, and follow-up skills.
- Ability to work under pressure and demonstrate strong commitment to achieving production and quality goals.
- Proficiency in Microsoft PowerPoint, Excel, and Word.
Desired Qualifications
- Preferably at least 2 years of relevant working experience as a Process Engineer in semiconductor assembly or backend manufacturing.
- Fresh graduates with strong technical aptitude and interest in semiconductor manufacturing may also be considered.
- Knowledge of statistical and quality tools such as SPC and MSA is preferred.
- A proactive team player who is hands-on, detail-oriented, and comfortable working in a dynamic manufacturing environment.
- Able to adapt to changing priorities while maintaining focus on safety, quality, delivery, and continuous improvement.
- Passionate about semiconductor manufacturing and motivated to develop strong technical ownership of interconnect packages.
Benefits
- Qualcomm is an equal opportunity employer.
- Qualcomm is committed to providing an accessible process for individuals with disabilities.
- Qualcomm is committed to making our workplace accessible for individuals with disabilities.
#semiconductor packaging#process engineering#manufacturing#flip chip bonding#backend semiconductor
Company
Qualcomm
Job Posted
2 weeks ago
Employment Type
Full Time
WorkMode
On Site
Experience Level
Associate
Locations
Singapore, Singapore
Qualification
Bachelor
Applicants
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