Advance the SPICE modeling capabilities of new GaAs pHEMT/HBT, GaN HEMT and CMOS technology for RF applications.

· Support RF product development teams modeling requirements for NPI (New Product Introduction) process. Work closely with foundries & product teams to ensure timely delivery of RF models.

· Modeling of linear and non-linear RF circuit elements used with our RF transistors. This includes model extraction using tools such as ICCAP & ADS/AWR.

· Evaluate foundry SPICE models and collaborate with foundries to solve modeling issues and advance simulation accuracy.

· Work on test chip specification & hands-on test structure characterization: DC IV, S-parameters & pulsed IV. Model validation by making load pull measurements for large signal performance & impedance.

· Help create improved simulation & design methodologies for GaAs, GaN & CMOS RF technologies. Work closely with CAD teams and EDA vendors to implement such methodologies.

· Actively participate in industry modeling forums and conferences through publication or event participation.