Director of package design
Technology, Data & Digital · Software & Web Development · Embedded Systems
In short
Microsoft is looking for a Director of package design to lead its advanced packaging design team. This role will drive optimal silicon packaging solutions for Azure datacenter roadmaps, focusing on chiplet architecture and advanced 2.5D/3D packaging from definition to tapeout. The position requires extensive experience in semiconductor package design and a strong ability to mentor engineering teams.
Responsibilities
- Lead and mentor a team of talented package design engineers, supporting their career growth and professional development.
- Drive optimal silicon packaging solution supporting Azure datacenter product roadmap.
- Drive package technology for chiplet architecture with advanced 2.5D/3D packaging.
- Drive 2.5D/3D packaging product designs (bridge/interposer/substrate) from definition, development to tapeout.
- Define, design and develop test vehicles to validate Silicon, Package, System performance.
- Drive supplier assessments and manage suppliers through definition, development, qualification and production.
- Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options.
- Define EDA tools requirements for advanced 3DIC packaging designs.
- Design and develop package and assembly drawings to support the manufacturing.
- Assess and characterize the reliability of Integrated Circuits (IC) packages.
- Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
- Drive execution of architecture solutions across product lines or multiple product groups and across teams that account for design trends and future concepts by leveraging cross-functional expertise, industry best practices, and lessons learned from teams working across multiple product lines.
- Drive engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.
Requirements
- Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR Equivalent Experience.
- Ability to meet Microsoft, customer and/or government security screening requirements.
- Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
- This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations.
- As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status for assessment of eligibility to access the export-controlled information.
- To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport.
- Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
Desired Qualifications
- Doctorate in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 10+ years technical engineering experience OR Master's Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 15+ years technical engineering experience OR Bachelor's Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 18+ years technical engineering experience OR equivalent experience.
- 15+ years of hands-on experience in Semiconductor Package design, development, manufacturing, supplier management or quality management.
- Experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D).
- Foundation in advanced packaging technologies, manufacturing and supplier management.
- Proficient in IC package or PCB board layout CAD tools Cadence Allegro*.
- Working knowledge in high-speed signaling, layout, electrical, mechanical and thermal co-designs.
- Working knowledge in 2D and 3D simulation tools for full package layout extractions for power and signals analysis.
- Experience with OSAT, Supplier & Foundry technologies.
- Experience in physical failure analysis.
- Experience in subcontract supplier management.
- Experience in cross-functional team environment.
Benefits
- The typical base pay range for this role across the U.S. is USD $142,800 - $274,800 per year.
- There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.
- Certain roles may be eligible for benefits and other compensation.
- Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay
#Silicon Engineering#Hardware Engineering#Cloud Infrastructure#Azure Cobalt#package design#advanced packaging#chiplet architecture#2.5D/3D packaging#tapeout#test vehicles#FMEA#EDA tools#IC packages#supplier management#cross-functional team
Company
Microsoft
Job Posted
3 weeks ago
Employment Type
Full Time
WorkMode
Hybrid
Experience Level
Executive
Locations
United States
Qualification
Doctoral, Master, Bachelor
Applicants
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